Naohiro Mashino

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method of manufacturing wiring board
- Patent number 11,659,667
- Issue date May 23, 2023
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, method of fabricating printed circuit board,...
- Patent number 8,179,689
- Issue date May 15, 2012
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor device and method of manufacturing the same
- Patent number 8,101,461
- Issue date Jan 24, 2012
- Shinko Electric Industries Co., Ltd.
- Akihito Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrophilic treatment method and wiring pattern forming method
- Patent number 8,007,649
- Issue date Aug 30, 2011
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor device, and method of manufacturing the same
- Patent number 8,004,382
- Issue date Aug 23, 2011
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Capacitor built-in substrate and method of manufacturing the same a...
- Patent number 7,936,568
- Issue date May 3, 2011
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor built-in wiring board having shield function
- Patent number 7,929,320
- Issue date Apr 19, 2011
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for filling through hole
- Patent number 7,909,976
- Issue date Mar 22, 2011
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor built-in interposer and method of manufacturing the same...
- Patent number 7,755,910
- Issue date Jul 13, 2010
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,655,504
- Issue date Feb 2, 2010
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic parts packaging structure and method of manufacturing th...
- Patent number 7,530,163
- Issue date May 12, 2009
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts packaging structure and method of manufacturing th...
- Patent number 7,217,888
- Issue date May 15, 2007
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing a wiring board having a via
- Patent number 7,205,230
- Issue date Apr 17, 2007
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing of circuit board; for semiconductor device
- Patent number 7,114,251
- Issue date Oct 3, 2006
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a packaging structure for electronic parts...
- Patent number 7,084,009
- Issue date Aug 1, 2006
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts packaging structure having mutually connected elec...
- Patent number 6,943,442
- Issue date Sep 13, 2005
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing micro-semiconductor element
- Patent number 6,872,634
- Issue date Mar 29, 2005
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of plugging through-holes in silicon substrate
- Patent number 6,815,348
- Issue date Nov 9, 2004
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of production of same
- Patent number 6,703,310
- Issue date Mar 9, 2004
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of production of same
- Patent number 6,699,787
- Issue date Mar 2, 2004
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming through-hole or recess in silicon substrate
- Patent number 6,670,269
- Issue date Dec 30, 2003
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including primary connecting plug and an auxil...
- Patent number 6,661,077
- Issue date Dec 9, 2003
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production process thereof
- Patent number 6,548,891
- Issue date Apr 15, 2003
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and semiconductor device
- Patent number 6,545,353
- Issue date Apr 8, 2003
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer for semiconductor, method for manufacturing the same and...
- Patent number 6,507,497
- Issue date Jan 14, 2003
- Shinko Electric Industries, Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly of plurality of semiconductor devices
- Patent number 6,433,415
- Issue date Aug 13, 2002
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20240276653
- Publication date Aug 15, 2024
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240047329
- Publication date Feb 8, 2024
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20220046800
- Publication date Feb 10, 2022
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100231344
- Publication date Sep 16, 2010
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100148340
- Publication date Jun 17, 2010
- Shinko Electric Industries Co., Ltd.
- Akihito TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, METHOD OF FABRICATING PRINTED CIRCUIT BOARD,...
- Publication number 20090290317
- Publication date Nov 26, 2009
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME AND SEMIC...
- Publication number 20090243035
- Publication date Oct 1, 2009
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR BUILT-IN WIRING BOARD HAVING SHIELD FUNCTION
- Publication number 20090008148
- Publication date Jan 8, 2009
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor built-in substrate and method of manufacturing the same a...
- Publication number 20080291649
- Publication date Nov 27, 2008
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080233677
- Publication date Sep 25, 2008
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTANCE ELEMENT
- Publication number 20080164967
- Publication date Jul 10, 2008
- Naohiro MASHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor built-in interposer and method of manufacturing the same...
- Publication number 20080030968
- Publication date Feb 7, 2008
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for filling through hole
- Publication number 20070170065
- Publication date Jul 26, 2007
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electronic parts packaging structure and method of manufacturing th...
- Publication number 20060073639
- Publication date Apr 6, 2006
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hydrophilic treatment method and wiring pattern forming method
- Publication number 20050173251
- Publication date Aug 11, 2005
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for manufacturing a wiring board having a via
- Publication number 20050048770
- Publication date Mar 3, 2005
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PARTS PACKAGING STRUCTURE AND METHOD OF MANUFACTURING TH...
- Publication number 20040209399
- Publication date Oct 21, 2004
- SHINKO ELECTRIC INDUSTRIES CO., LTD
- Masahiro SUNOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic parts packaging structure and method of manufacturing th...
- Publication number 20040113260
- Publication date Jun 17, 2004
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic parts packaging structure and method of manufacturing th...
- Publication number 20040113261
- Publication date Jun 17, 2004
- SHINKO ELECTRIC INDUSTRIES CO., LTD.,
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of plugging through-holes in silicon substrate
- Publication number 20030235982
- Publication date Dec 25, 2003
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20030232486
- Publication date Dec 18, 2003
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of machining silicon wafer
- Publication number 20030232580
- Publication date Dec 18, 2003
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module structure incorporating antenna
- Publication number 20030230797
- Publication date Dec 18, 2003
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing micro-semiconductor element
- Publication number 20030228719
- Publication date Dec 11, 2003
- Shinko Electric Industries Co. Ltd
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device and its device
- Publication number 20030092256
- Publication date May 15, 2003
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer for semiconductor, method for manufacturing same, and se...
- Publication number 20030086248
- Publication date May 8, 2003
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming through-hole or recess in silicon substrate
- Publication number 20030073299
- Publication date Apr 17, 2003
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of production of same
- Publication number 20020190375
- Publication date Dec 19, 2002
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of production of same
- Publication number 20020190371
- Publication date Dec 19, 2002
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of production of circuit board, semiconductor device, and pl...
- Publication number 20020170173
- Publication date Nov 21, 2002
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS

Naohiro Mashino

Person

Patents Grantslast 30 patents

Wiring board and method of manufacturing wiring board

Printed circuit board, method of fabricating printed circuit board,...

Stacked semiconductor device and method of manufacturing the same

Hydrophilic treatment method and wiring pattern forming method

Inductor device, and method of manufacturing the same

Capacitor built-in substrate and method of manufacturing the same a...

Inductor built-in wiring board having shield function

Method for filling through hole

Capacitor built-in interposer and method of manufacturing the same...

Semiconductor device and method of manufacturing the same

Electronic parts packaging structure and method of manufacturing th...

Electronic parts packaging structure and method of manufacturing th...

Process for manufacturing a wiring board having a via

Method of producing of circuit board; for semiconductor device

Method of manufacturing a packaging structure for electronic parts...

Electronic parts packaging structure having mutually connected elec...

Method of manufacturing micro-semiconductor element

Method of plugging through-holes in silicon substrate

Semiconductor device and method of production of same

Semiconductor device and method of production of same

Method of forming through-hole or recess in silicon substrate

Semiconductor device including primary connecting plug and an auxil...

Semiconductor device and production process thereof

Multilayer wiring board and semiconductor device

Interposer for semiconductor, method for manufacturing the same and...

Assembly of plurality of semiconductor devices

Patents Applicationslast 30 patents

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

INDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD, METHOD OF FABRICATING PRINTED CIRCUIT BOARD,...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME AND SEMIC...

INDUCTOR BUILT-IN WIRING BOARD HAVING SHIELD FUNCTION

Capacitor built-in substrate and method of manufacturing the same a...

Semiconductor device and method of manufacturing the same

INDUCTANCE ELEMENT

Capacitor built-in interposer and method of manufacturing the same...

Method for filling through hole

Electronic parts packaging structure and method of manufacturing th...

Hydrophilic treatment method and wiring pattern forming method

Process for manufacturing a wiring board having a via

ELECTRONIC PARTS PACKAGING STRUCTURE AND METHOD OF MANUFACTURING TH...

Electronic parts packaging structure and method of manufacturing th...

Electronic parts packaging structure and method of manufacturing th...

Method of plugging through-holes in silicon substrate

Semiconductor device and method of manufacturing the same

Method of machining silicon wafer

Semiconductor module structure incorporating antenna

Method of manufacturing micro-semiconductor element

Method of manufacturing semiconductor device and its device

Interposer for semiconductor, method for manufacturing same, and se...

Method of forming through-hole or recess in silicon substrate

Semiconductor device and method of production of same

Semiconductor device and method of production of same

Method of production of circuit board, semiconductor device, and pl...