Naohiro Moriya

Person

Sakata-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,614,119
- Issue date Sep 2, 2003
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices
- Patent number 6,511,910
- Issue date Jan 28, 2003
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact structure using aluminum
- Patent number 6,486,555
- Issue date Nov 26, 2002
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 6,429,493
- Issue date Aug 6, 2002
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices
- Patent number 6,350,685
- Issue date Feb 26, 2002
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,194,304
- Issue date Feb 27, 2001
- Seiko Epson Corporation
- Yukio Morozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,144,097
- Issue date Nov 7, 2000
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,137,176
- Issue date Oct 24, 2000
- Seiko Epson Corporation
- Yukio Morozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,107,182
- Issue date Aug 22, 2000
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20040048460
- Publication date Mar 11, 2004
- SEIKO EPSON CORPORATION
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing semiconductor dev...
- Publication number 20020180043
- Publication date Dec 5, 2002
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONTACT STRUTURE USING ALUMINUM
- Publication number 20020014696
- Publication date Feb 7, 2002
- MICHIO ASAHINA
- H01 - BASIC ELECTRIC ELEMENTS

Naohiro Moriya

Person

Patents Grantslast 30 patents

Semiconductor device and method of fabricating the same

Method for manufacturing semiconductor devices

Semiconductor device having a contact structure using aluminum

Semiconductor device and method for manufacturing semiconductor device

Method for manufacturing semiconductor devices

Semiconductor device and method of fabricating the same

Semiconductor device and method of fabricating the same

Semiconductor device and method of fabricating the same

Semiconductor device and method of fabricating the same

Patents Applicationslast 30 patents

Semiconductor device and method of fabricating the same

Semiconductor device and method for manufacturing semiconductor dev...

SEMICONDUCTOR DEVICE HAVING A CONTACT STRUTURE USING ALUMINUM