Naohisa HARADA

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Chita-gun, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module bonding structure and bonding method
- Patent number 11,145,589
- Issue date Oct 12, 2021
- Denso Corporation
- Naohisa Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric power converter
- Patent number 10,186,979
- Issue date Jan 22, 2019
- Denso Corporation
- Naohisa Harada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electric power convertor
- Patent number 10,076,068
- Issue date Sep 11, 2018
- Nippon Soken, Inc.
- Shinji Ohoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric power converter
- Patent number 9,756,755
- Issue date Sep 5, 2017
- Denso Corporation
- Naohisa Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE BONDING STRUCTURE AND BONDING METHOD
- Publication number 20200203269
- Publication date Jun 25, 2020
- DENSO CORPORATION
- Naohisa HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC POWER CONVERTER
- Publication number 20160315549
- Publication date Oct 27, 2016
- DENSO CORPORATION
- Naohisa HARADA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRIC POWER CONVERTER
- Publication number 20160128216
- Publication date May 5, 2016
- DENSO CORPORATION
- Naohisa HARADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC POWER CONVERTOR
- Publication number 20150195957
- Publication date Jul 9, 2015
- NIPPON SOKEN, INC.
- Shinji OHOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR