Naoji Senba

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device assembly and a method of connecting electronic de...
- Patent number 6,798,070
- Issue date Sep 28, 2004
- NEC Corporation
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a bump structure
- Patent number 6,625,883
- Issue date Sep 30, 2003
- NEC Corporation
- Koji Soejima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device assembly and a method of connecting electronic de...
- Patent number 6,576,499
- Issue date Jun 10, 2003
- NEC Corporation
- Takuo Funaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional semiconductor device and method of manufacturing...
- Patent number 6,486,540
- Issue date Nov 26, 2002
- NEC Corporation
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for lining up micro-balls
- Patent number 6,422,452
- Issue date Jul 23, 2002
- Japan E M Co., Ltd.
- Takumi Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball arrangement device
- Patent number 6,378,756
- Issue date Apr 30, 2002
- NEC Corporation
- Nobuaki Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Function element, substrate for mounting function element thereon,...
- Patent number 6,313,533
- Issue date Nov 6, 2001
- NEC Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method for making the same
- Patent number 6,307,159
- Issue date Oct 23, 2001
- NEC Corporation
- Koji Soejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card and method of forming a probe card
- Patent number 6,307,392
- Issue date Oct 23, 2001
- NEC Corporation
- Koji Soejima
- G01 - MEASURING TESTING
Information Patent Grant
Multistage coupling semiconductor carrier, semiconductor device usi...
- Patent number 6,194,787
- Issue date Feb 27, 2001
- NEC Corporation
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip carrier having partially buried conductive patte...
- Patent number 6,191,482
- Issue date Feb 20, 2001
- NEC Corporation
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packing stack module and method of producing the same
- Patent number 6,188,127
- Issue date Feb 13, 2001
- NEC Corporation
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card with plural probe tips on a unitary flexible tongue
- Patent number 6,114,864
- Issue date Sep 5, 2000
- NEC Corporation
- Koji Soejima
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication method of plastic-molded lead component
- Patent number 6,096,259
- Issue date Aug 1, 2000
- NEC Corporation
- Nobuaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball arrangement device
- Patent number 6,095,398
- Issue date Aug 1, 2000
- NEC Corporation
- Nobuaki Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for arranging minute metallic balls
- Patent number 5,976,965
- Issue date Nov 2, 1999
- NEC Corporation
- Nobuaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked carrier three-dimensional memory module and semiconductor d...
- Patent number 5,973,392
- Issue date Oct 26, 1999
- NEC Corporation
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package and IC probe card with organic substrate
- Patent number 5,936,845
- Issue date Aug 10, 1999
- NEC Corporation
- Koji Soejima
- G01 - MEASURING TESTING
Information Patent Grant
Stack module
- Patent number 5,883,426
- Issue date Mar 16, 1999
- NEC Corporation
- Kenichi Tokuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 5,793,117
- Issue date Aug 11, 1998
- NEC Corporation
- Yuzo Shimada
- G01 - MEASURING TESTING
Information Patent Grant
Sealing structure for bumps on a semiconductor integrated circuit chip
- Patent number 5,600,180
- Issue date Feb 4, 1997
- NEC Corporation
- Teruo Kusaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level wiring structure having an organic interlayer insulatin...
- Patent number 5,310,965
- Issue date May 10, 1994
- NEC Corporation
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor manufacturing apparatus and method, semiconductor dev...
- Publication number 20030085256
- Publication date May 8, 2003
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, production method thereof, and coil spring cu...
- Publication number 20020056922
- Publication date May 16, 2002
- NEC Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device assembly and a method of connecting electronic de...
- Publication number 20020042164
- Publication date Apr 11, 2002
- NEC Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump structure and method for making the same
- Publication number 20020038509
- Publication date Apr 4, 2002
- NEC Corporation
- Koji Soejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional semiconductor device and method of manufacturing...
- Publication number 20020022303
- Publication date Feb 21, 2002
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20010054762
- Publication date Dec 27, 2001
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for transferring micro-balls
- Publication number 20010015372
- Publication date Aug 23, 2001
- E .M Co., Ltd.,
- Takumi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for lining up micro-balls
- Publication number 20010009261
- Publication date Jul 26, 2001
- Japan E M Co., Ltd.
- Takumi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device assembly and a method of connecting electronic de...
- Publication number 20010003656
- Publication date Jun 14, 2001
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS

Naoji Senba

Person

Patents Grantslast 30 patents

Electronic device assembly and a method of connecting electronic de...

Method for making a bump structure

Electronic device assembly and a method of connecting electronic de...

Three-dimensional semiconductor device and method of manufacturing...

Method and apparatus for lining up micro-balls

Solder ball arrangement device

Function element, substrate for mounting function element thereon,...

Bump structure and method for making the same

Probe card and method of forming a probe card

Multistage coupling semiconductor carrier, semiconductor device usi...

Semiconductor chip carrier having partially buried conductive patte...

Semiconductor packing stack module and method of producing the same

Probe card with plural probe tips on a unitary flexible tongue

Fabrication method of plastic-molded lead component

Solder ball arrangement device

Method for arranging minute metallic balls

Stacked carrier three-dimensional memory module and semiconductor d...

IC package and IC probe card with organic substrate

Stack module

Semiconductor device and method of fabricating the same

Sealing structure for bumps on a semiconductor integrated circuit chip

Multi-level wiring structure having an organic interlayer insulatin...

Patents Applicationslast 30 patents

Semiconductor manufacturing apparatus and method, semiconductor dev...

Semiconductor device, production method thereof, and coil spring cu...

Electronic device assembly and a method of connecting electronic de...

Bump structure and method for making the same

Three-dimensional semiconductor device and method of manufacturing...

Semiconductor device and method of fabricating the same

Apparatus for transferring micro-balls

Method and apparatus for lining up micro-balls

Electronic device assembly and a method of connecting electronic de...