Naoki AKIYAMA

Person

Nirasaki City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Inspection apparatus and inspection method
- Patent number 11,940,485
- Issue date Mar 26, 2024
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection apparatus and inspection method
- Patent number 11,927,539
- Issue date Mar 12, 2024
- Tokyo Electron Limited
- Naoki Akiyama
- G01 - MEASURING TESTING
Information Patent Grant
Inspection apparatus and inspection method
- Patent number 11,525,856
- Issue date Dec 13, 2022
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage and inspection apparatus for inspecting electronic device
- Patent number 11,499,993
- Issue date Nov 15, 2022
- Tokyo Electron Limited
- Dai Kobayashi
- G01 - MEASURING TESTING
Information Patent Grant
Joining device and joining position adjustment method using joining...
- Patent number 9,263,312
- Issue date Feb 16, 2016
- Tokyo Electron Limited
- Michikazu Nakamura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Mounting method and mounting device
- Patent number 8,749,068
- Issue date Jun 10, 2014
- Tokyo Electron Limited
- Michikazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 8,434,538
- Issue date May 7, 2013
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 8,286,853
- Issue date Oct 16, 2012
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 8,210,417
- Issue date Jul 3, 2012
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INSPECTION APPARATUS AND INSPECTION METHOD
- Publication number 20210389366
- Publication date Dec 16, 2021
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION APPARATUS AND INSPECTION METHOD
- Publication number 20210382105
- Publication date Dec 9, 2021
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION APPARATUS AND INSPECTION METHOD
- Publication number 20210356405
- Publication date Nov 18, 2021
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- G01 - MEASURING TESTING
Information Patent Application
STAGE AND INSPECTION APPARATUS
- Publication number 20210156891
- Publication date May 27, 2021
- TOKYO ELECTRON LIMITED
- Dai KOBAYASHI
- G01 - MEASURING TESTING
Information Patent Application
BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20160001543
- Publication date Jan 7, 2016
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20150017782
- Publication date Jan 15, 2015
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING DEVICE AND JOINING POSITION ADJUSTMENT METHOD USING JOINING...
- Publication number 20140311653
- Publication date Oct 23, 2014
- TOKYO ELECTRON LIMITED
- Michikazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD AND MOUNTING DEVICE
- Publication number 20120291950
- Publication date Nov 22, 2012
- TOKYO ELECTRON LIMITED
- Masahiko Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD AND MOUNTING DEVICE
- Publication number 20120292775
- Publication date Nov 22, 2012
- TOKYO ELECTRON LIMITED
- Michikazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120103533
- Publication date May 3, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20120091186
- Publication date Apr 19, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120091187
- Publication date Apr 19, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS

Naoki AKIYAMA

Person

Patents Grantslast 30 patents

Inspection apparatus and inspection method

Inspection apparatus and inspection method

Inspection apparatus and inspection method

Stage and inspection apparatus for inspecting electronic device

Joining device and joining position adjustment method using joining...

Mounting method and mounting device

Bonding apparatus and bonding method

Bonding apparatus and bonding method

Bonding apparatus

Patents Applicationslast 30 patents

INSPECTION APPARATUS AND INSPECTION METHOD

INSPECTION APPARATUS AND INSPECTION METHOD

INSPECTION APPARATUS AND INSPECTION METHOD

STAGE AND INSPECTION APPARATUS

BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD

BONDING DEVICE AND BONDING METHOD

JOINING DEVICE AND JOINING POSITION ADJUSTMENT METHOD USING JOINING...

MOUNTING METHOD AND MOUNTING DEVICE

MOUNTING METHOD AND MOUNTING DEVICE

BONDING APPARATUS AND BONDING METHOD

BONDING APPARATUS

BONDING APPARATUS AND BONDING METHOD