Naoki KAMIHAMA

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Nishigo-mura, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for selecting template assembly, method for polishing workpi...
- Patent number 11,731,236
- Issue date Aug 22, 2023
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing silicon wafer
- Patent number 10,913,137
- Issue date Feb 9, 2021
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polishing wafer and polishing apparatus
- Patent number 10,744,615
- Issue date Aug 18, 2020
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR POLISHING SILICON WAFER
- Publication number 20200114488
- Publication date Apr 16, 2020
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR SELECTING TEMPLATE ASSEMBLY, METHOD FOR POLISHING WORKPI...
- Publication number 20190126431
- Publication date May 2, 2019
- Shin-Etsu Handotai Co., Ltd.
- Kazuya SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR POLISHING WAFER AND POLISHING APPARATUS
- Publication number 20180290261
- Publication date Oct 11, 2018
- Shin-Etsu Handotai Co., Ltd.
- Kazuya SATO
- B24 - GRINDING POLISHING