Naoki KATSUDA

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Ogaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board
- Patent number 9,661,762
- Issue date May 23, 2017
- Ibiden Co., Ltd.
- Naoki Katsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board for mounting semiconductor element
- Patent number 9,374,903
- Issue date Jun 21, 2016
- Ibiden Co., Ltd.
- Naoki Katsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150319842
- Publication date Nov 5, 2015
- IBIDEN CO., LTD.
- Koji ASANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20150122530
- Publication date May 7, 2015
- IBIDEN CO., LTD.
- Naoki KATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT
- Publication number 20140262447
- Publication date Sep 18, 2014
- IBIDEN CO., LTD.
- Naoki KATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR