Naoki Kawanabe

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Kodaira, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having improved adhesion between bonding and b...
- Patent number 7,449,786
- Issue date Nov 11, 2008
- Renesas Technology Corp.
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device to provide improved...
- Patent number 7,049,214
- Issue date May 23, 2006
- Renesas Technology Corp.
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,015,127
- Issue date Mar 21, 2006
- Renesas Technology Corp.
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device having improved adhesion between bonding and b...
- Publication number 20060138679
- Publication date Jun 29, 2006
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device to provide improved...
- Publication number 20050035449
- Publication date Feb 17, 2005
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20030168740
- Publication date Sep 11, 2003
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS