Naoki Kawashima

Person

Nagoya, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Environmental barrier coating
- Patent number 10,011,724
- Issue date Jul 3, 2018
- IHI Corporation
- Takeshi Nakamura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low-adhesion material, resin molding die, and soil resistant material
- Patent number 7,901,797
- Issue date Mar 8, 2011
- Towa Corporation
- Takaki Kuno
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Low-adhesion material, mold for molding resin using the same and co...
- Patent number 7,784,764
- Issue date Aug 31, 2010
- Towa Corporation
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Conductive porous material, resin molding die employing the same, a...
- Patent number 7,732,037
- Issue date Jun 8, 2010
- Towa Corporation
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of evaluating adhesion property, low-adhesion material, and...
- Patent number 7,614,293
- Issue date Nov 10, 2009
- Towa Corporation
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Composite material and resin mold
- Patent number 7,407,146
- Issue date Aug 5, 2008
- Towa Corporation
- Takaki Kuno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin mold material and resin mold
- Patent number 7,287,975
- Issue date Oct 30, 2007
- Towa Corporation
- Kazuhiko Bandoh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Platen for electrostatic wafer clamping apparatus
- Patent number 6,660,665
- Issue date Dec 9, 2003
- Japan Fine Ceramics Center
- Hiroaki Yanagida
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
THERMAL BARRIER COATING MATERIAL AND ARTICLE
- Publication number 20210199054
- Publication date Jul 1, 2021
- JAPAN FINE CERAMICS CENTER
- Tsuneaki MATSUDAIRA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMAL BARRIER COATING
- Publication number 20210047968
- Publication date Feb 18, 2021
- JAPAN FINE CERAMICS CENTER
- Tsuneaki MATSUDAIRA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENVIRONMENTAL BARRIER COATING
- Publication number 20170190920
- Publication date Jul 6, 2017
- IHI Corporation
- Takeshi NAKAMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND...
- Publication number 20120076886
- Publication date Mar 29, 2012
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND...
- Publication number 20110042857
- Publication date Feb 24, 2011
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND...
- Publication number 20100012816
- Publication date Jan 21, 2010
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Low-Adhesion Material, Resin Molding Die, and Soil Resistant Material
- Publication number 20090107361
- Publication date Apr 30, 2009
- TOWA CORPORATION
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Low Adhesion Material, Resin Molding Die, and Soil Resistant Material
- Publication number 20080296532
- Publication date Dec 4, 2008
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of Evaluating Adhesion Property, Low-Adhesion Material, and...
- Publication number 20080254286
- Publication date Oct 16, 2008
- TOWA CORPORATION
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Conductive porous material, resin molding die employing the same, a...
- Publication number 20060286346
- Publication date Dec 21, 2006
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Low-adhesion material and mold for molding resin using the same
- Publication number 20060093693
- Publication date May 4, 2006
- TOWO CORPORATION JAPAN FINE CERAMICS CENTER
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Composite material and resin mold
- Publication number 20050154113
- Publication date Jul 14, 2005
- TOWA CORPORATION
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin mold material and resin mold
- Publication number 20040253334
- Publication date Dec 16, 2004
- TOWA CORPORATION
- Kazuhiko Bandoh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PLATEN FOR ELECTROSTATIC WAFER CLAMPING APPARATUS
- Publication number 20030207596
- Publication date Nov 6, 2003
- Hiroaki Yanagida
- H01 - BASIC ELECTRIC ELEMENTS

Naoki Kawashima

Person

Patents Grantslast 30 patents

Environmental barrier coating

Low-adhesion material, resin molding die, and soil resistant material

Low-adhesion material, mold for molding resin using the same and co...

Conductive porous material, resin molding die employing the same, a...

Method of evaluating adhesion property, low-adhesion material, and...

Composite material and resin mold

Resin mold material and resin mold

Platen for electrostatic wafer clamping apparatus

Patents Applicationslast 30 patents

THERMAL BARRIER COATING MATERIAL AND ARTICLE

THERMAL BARRIER COATING

ENVIRONMENTAL BARRIER COATING

METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND...

METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND...

METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND...

Low-Adhesion Material, Resin Molding Die, and Soil Resistant Material

Low Adhesion Material, Resin Molding Die, and Soil Resistant Material

Method of Evaluating Adhesion Property, Low-Adhesion Material, and...

Conductive porous material, resin molding die employing the same, a...

Low-adhesion material and mold for molding resin using the same

Composite material and resin mold

Resin mold material and resin mold

PLATEN FOR ELECTROSTATIC WAFER CLAMPING APPARATUS