Naoki Kobayashi

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Nagano-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive layer bonding a plurality of substrates having a fillet ra...
- Patent number 11,233,001
- Issue date Jan 25, 2022
- Shinko Electric Industries Co., Ltd.
- Shota Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, stacked wiring substrate, and manufacturing metho...
- Patent number 10,959,328
- Issue date Mar 23, 2021
- SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Naoki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE, STACKED WIRING SUBSTRATE, AND MANUFACTURING METHO...
- Publication number 20210007220
- Publication date Jan 7, 2021
- Shinko Electric Industries Co., Ltd.
- Naoki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATIN...
- Publication number 20200211946
- Publication date Jul 2, 2020
- Shinko Electric Industries Co., Ltd.
- Shota Miki
- H01 - BASIC ELECTRIC ELEMENTS