Naoki Kurosu

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Fujisawa-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method and apparatus
- Patent number 6,676,005
- Issue date Jan 13, 2004
- International Business Machines Corporation
- Kenji Itoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding performing method and method for transforming, r...
- Patent number 6,382,499
- Issue date May 7, 2002
- International Business Machines Corporation
- Takuya Satoh
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for ultrasonically connecting and inspecting slider-lead joi...
- Patent number 6,355,122
- Issue date Mar 12, 2002
- International Business Machines Corporation
- Kenji Itoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wire bonding method and apparatus
- Publication number 20030010806
- Publication date Jan 16, 2003
- Kenji Itoh
- H01 - BASIC ELECTRIC ELEMENTS