Naoki Miyashima

Person

Aizuwakamatsu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Copper alloy plate, copper alloy plate with plating film, and metho...
- Patent number 11,926,889
- Issue date Mar 12, 2024
- Mitsubishi Materials Corporation
- Kenji Morikawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper alloy sheet, copper alloy sheet with plating film, and metho...
- Patent number 11,920,228
- Issue date Mar 5, 2024
- Mitsubishi Materials Corporation
- Yoshiteru Akisaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Terminal material for connector
- Patent number 11,905,614
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper alloy plate, copper alloy plate with plating film, and manuf...
- Patent number 11,795,525
- Issue date Oct 24, 2023
- Mitsubishi Materials Corporation
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper alloy plate, plating film-attached copper alloy plate, and m...
- Patent number 11,781,234
- Issue date Oct 10, 2023
- Mitsubishi Materials Corporation
- Naoki Miyashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
Cu-Ni-Si BASED COPPER ALLOY PLATE, Cu-Ni-Si BASED COPPER ALLOY PLAT...
- Publication number 20230143481
- Publication date May 11, 2023
- MITSUBISHI MATERIALS CORPORATION
- Kazuaki Sakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ALLOY SHEET, COPPER ALLOY SHEET WITH PLATING FILM, AND METHO...
- Publication number 20230047984
- Publication date Feb 16, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiteru Akisaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
TERMINAL MATERIAL FOR CONNECTOR
- Publication number 20220380924
- Publication date Dec 1, 2022
- MITSUBISHI MATERIALS CORPORATION
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND METHO...
- Publication number 20220316028
- Publication date Oct 6, 2022
- MITSUBISHI MATERIALS CORPORATION
- Kenji Morikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND MANUF...
- Publication number 20220145424
- Publication date May 12, 2022
- MITSUBISHI MATERIALS CORPORATION
- Naoki Miyashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY PLATE, PLATING FILM-ATTACHED COPPER ALLOY PLATE, AND M...
- Publication number 20220081738
- Publication date Mar 17, 2022
- MITSUBISHI MATERIALS CORPORATION
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Naoki Miyashima

Person

Patents Grantslast 30 patents

Copper alloy plate, copper alloy plate with plating film, and metho...

Copper alloy sheet, copper alloy sheet with plating film, and metho...

Terminal material for connector

Copper alloy plate, copper alloy plate with plating film, and manuf...

Copper alloy plate, plating film-attached copper alloy plate, and m...

Patents Applicationslast 30 patents

Cu-Ni-Si BASED COPPER ALLOY PLATE, Cu-Ni-Si BASED COPPER ALLOY PLAT...

COPPER ALLOY SHEET, COPPER ALLOY SHEET WITH PLATING FILM, AND METHO...

TERMINAL MATERIAL FOR CONNECTOR

COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND METHO...

COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND MANUF...

COPPER ALLOY PLATE, PLATING FILM-ATTACHED COPPER ALLOY PLATE, AND M...