Naoki Murazawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Protective film thickness measuring method
- Patent number 11,892,282
- Issue date Feb 6, 2024
- Disco Corporation
- Hiroto Yoshida
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for detecting facet region, wafer producing me...
- Patent number 11,340,163
- Issue date May 24, 2022
- Disco Corporation
- Yusaku Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recess or through-hole forming method and electrode forming method
- Patent number 11,110,549
- Issue date Sep 7, 2021
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Facet region detecting method and detecting apparatus
- Patent number 10,852,240
- Issue date Dec 1, 2020
- Disco Corporation
- Naoki Murazawa
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
DIAMOND SUBSTRATE MANUFACTURING METHOD
- Publication number 20240001490
- Publication date Jan 4, 2024
- Disco Corporation
- Naoki MURAZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSPECTION APPARATUS
- Publication number 20230280249
- Publication date Sep 7, 2023
- Disco Corporation
- Naoki MURAZAWA
- G01 - MEASURING TESTING
Information Patent Application
PROTECTIVE FILM THICKNESS MEASURING METHOD
- Publication number 20220373321
- Publication date Nov 24, 2022
- Disco Corporation
- Hiroto YOSHIDA
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR DETECTING FACET REGION, WAFER PRODUCING ME...
- Publication number 20220236185
- Publication date Jul 28, 2022
- Disco Corporation
- Yusaku ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DETECTING FACET REGION, WAFER PRODUCING ME...
- Publication number 20200150038
- Publication date May 14, 2020
- Disco Corporation
- Yusaku ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACET REGION DETECTING METHOD AND DETECTING APPARATUS
- Publication number 20200064269
- Publication date Feb 27, 2020
- Disco Corporation
- Naoki MURAZAWA
- G01 - MEASURING TESTING
Information Patent Application
RECESS OR THROUGH-HOLE FORMING METHOD AND ELECTRODE FORMING METHOD
- Publication number 20190193205
- Publication date Jun 27, 2019
- Disco Corporation
- Kazuma SEKIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20160172182
- Publication date Jun 16, 2016
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS

Naoki Murazawa

Person

Patents Grantslast 30 patents

Protective film thickness measuring method

Method and apparatus for detecting facet region, wafer producing me...

Recess or through-hole forming method and electrode forming method

Facet region detecting method and detecting apparatus

Patents Applicationslast 30 patents

DIAMOND SUBSTRATE MANUFACTURING METHOD

INSPECTION APPARATUS

PROTECTIVE FILM THICKNESS MEASURING METHOD

METHOD AND APPARATUS FOR DETECTING FACET REGION, WAFER PRODUCING ME...

METHOD AND APPARATUS FOR DETECTING FACET REGION, WAFER PRODUCING ME...

FACET REGION DETECTING METHOD AND DETECTING APPARATUS

RECESS OR THROUGH-HOLE FORMING METHOD AND ELECTRODE FORMING METHOD

LASER PROCESSING APPARATUS