Naoki Ogawa

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor having improved dicing properties
- Patent number 11,594,563
- Issue date Feb 28, 2023
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including grooves
- Patent number 11,024,658
- Issue date Jun 1, 2021
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved dicing properties
- Patent number 10,608,028
- Issue date Mar 31, 2020
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged image sensor having improved dicing properties
- Patent number 10,038,021
- Issue date Jul 31, 2018
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved dicing properties, manufacturing appar...
- Patent number 9,991,301
- Issue date Jun 5, 2018
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY APPARATUS
- Publication number 20230052492
- Publication date Feb 16, 2023
- Sony Semiconductor Solutions Corporation
- NAOKI OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20220157873
- Publication date May 19, 2022
- SONY GROUP CORPORATION
- Naoki KOMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20210305300
- Publication date Sep 30, 2021
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20200273897
- Publication date Aug 27, 2020
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20180331142
- Publication date Nov 15, 2018
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20170271389
- Publication date Sep 21, 2017
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20170263665
- Publication date Sep 14, 2017
- SONY CORPORATION
- Naoki KOMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20170236860
- Publication date Aug 17, 2017
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20160284753
- Publication date Sep 29, 2016
- SONY CORPORATION
- Naoki KOMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single wafer cleaning apparatus and cleaning method thereof
- Publication number 20050252526
- Publication date Nov 17, 2005
- SONY CORPORATION
- Naoki Ogawa
- B08 - CLEANING

Naoki Ogawa

Person

Patents Grantslast 30 patents

Image sensor having improved dicing properties

Image sensor including grooves

Image sensor having improved dicing properties

Packaged image sensor having improved dicing properties

Image sensor having improved dicing properties, manufacturing appar...

Patents Applicationslast 30 patents

DISPLAY APPARATUS

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

Single wafer cleaning apparatus and cleaning method thereof