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Naoki Ohmiya

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Apparatus for dividing an adhesive film mounted on a wafer
    • Patent number 7,602,071
    • Issue date Oct 13, 2009
    • Disco Corporation
    • Naoki Ohmiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer holding mechanism
    • Patent number 7,557,904
    • Issue date Jul 7, 2009
    • Disco Corporation
    • Naoki Ohmiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer dividing method
    • Patent number 7,449,396
    • Issue date Nov 11, 2008
    • Disco Corporation
    • Masahiro Murata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser beam processing method for a semiconductor wafer
    • Patent number 7,265,033
    • Issue date Sep 4, 2007
    • Disco Corporation
    • Koichi Shigematsu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer dividing method
    • Patent number 7,179,722
    • Issue date Feb 20, 2007
    • Disco Corporation
    • Masahiro Murata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer dividing method and apparatus
    • Patent number 7,063,083
    • Issue date Jun 20, 2006
    • Disco Corporation
    • Naoki Ohmiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cutting machine
    • Patent number 6,726,526
    • Issue date Apr 27, 2004
    • Disco Corporation
    • Kazuma Sekiya
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Grant

    Blade cover in a cutting apparatus
    • Patent number 6,010,396
    • Issue date Jan 4, 2000
    • Disco Corporation
    • Naoki Ohmiya
    • B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

  • Information Patent Application

    Wafer holding mechanism
    • Publication number 20060203222
    • Publication date Sep 14, 2006
    • Naoki Ohmiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Tape expansion apparatus
    • Publication number 20060180136
    • Publication date Aug 17, 2006
    • DISCO CORPORATION
    • Yusuke Nagai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method and apparatus for dividing an adhesive film mounted on a wafer
    • Publication number 20060030129
    • Publication date Feb 9, 2006
    • DISCO CORPORATION
    • Naoki Ohmiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer dividing method and apparatus
    • Publication number 20060016443
    • Publication date Jan 26, 2006
    • DISCO CORPORATION
    • Naoki Ohmiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer dividing method
    • Publication number 20050170613
    • Publication date Aug 4, 2005
    • DISCO CORPORATION
    • Masahiro Murata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer dividing method
    • Publication number 20050170616
    • Publication date Aug 4, 2005
    • DISCO CORPORATION
    • Masahiro Murata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Laser beam processing method and laser beam processing machine
    • Publication number 20050009307
    • Publication date Jan 13, 2005
    • Koichi Shigematsu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Plate-like carrying mechanism and dicing device with carrying mecha...
    • Publication number 20040099112
    • Publication date May 27, 2004
    • Naoki Ohmiya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Cutting device
    • Publication number 20040083868
    • Publication date May 6, 2004
    • Naoki Ohmiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Cutting machine
    • Publication number 20020179079
    • Publication date Dec 5, 2002
    • Kazuma Sekiya
    • B28 - WORKING CEMENT, CLAY, OR STONE