Naoki Omiya

Person

  • Tokyo, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer producing apparatus

    • Patent number 10,981,250
    • Issue date Apr 20, 2021
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing apparatus

    • Patent number 10,916,460
    • Issue date Feb 9, 2021
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing apparatus and carrying tray

    • Patent number 10,910,241
    • Issue date Feb 2, 2021
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing apparatus

    • Patent number 10,840,116
    • Issue date Nov 17, 2020
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cutting machine

    • Patent number 6,568,385
    • Issue date May 27, 2003
    • Disco Corporation
    • Kazuma Sekiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    JIG FOR BEING INTEGRATED WITH INGOT

    • Publication number 20240227100
    • Publication date Jul 11, 2024
    • Disco Corporation
    • Naoki OMIYA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING APPARATUS

    • Publication number 20200130106
    • Publication date Apr 30, 2020
    • Disco Corporation
    • Kentaro IIZUKA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING APPARATUS AND CARRYING TRAY

    • Publication number 20190181024
    • Publication date Jun 13, 2019
    • Disco Corporation
    • Kentaro IIZUKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PRODUCING APPARATUS

    • Publication number 20190006212
    • Publication date Jan 3, 2019
    • Disco Corporation
    • Kentaro Iizuka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PRODUCING APPARATUS

    • Publication number 20180354067
    • Publication date Dec 13, 2018
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Cutting machine

    • Publication number 20020045414
    • Publication date Apr 18, 2002
    • Kazuma Sekiya
    • B28 - WORKING CEMENT, CLAY, OR STONE