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Naoki Omiya
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Tokyo, JP
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last 30 patents
Information
Patent Grant
Wafer producing apparatus
Patent number
10,981,250
Issue date
Apr 20, 2021
Disco Corporation
Kentaro Iizuka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer producing apparatus
Patent number
10,916,460
Issue date
Feb 9, 2021
Disco Corporation
Kentaro Iizuka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer producing apparatus and carrying tray
Patent number
10,910,241
Issue date
Feb 2, 2021
Disco Corporation
Kentaro Iizuka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer producing apparatus
Patent number
10,840,116
Issue date
Nov 17, 2020
Disco Corporation
Kentaro Iizuka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Cutting machine
Patent number
6,568,385
Issue date
May 27, 2003
Disco Corporation
Kazuma Sekiya
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
JIG FOR BEING INTEGRATED WITH INGOT
Publication number
20240227100
Publication date
Jul 11, 2024
Disco Corporation
Naoki OMIYA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WAFER PRODUCING APPARATUS
Publication number
20200130106
Publication date
Apr 30, 2020
Disco Corporation
Kentaro IIZUKA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WAFER PRODUCING APPARATUS AND CARRYING TRAY
Publication number
20190181024
Publication date
Jun 13, 2019
Disco Corporation
Kentaro IIZUKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER PRODUCING APPARATUS
Publication number
20190006212
Publication date
Jan 3, 2019
Disco Corporation
Kentaro Iizuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER PRODUCING APPARATUS
Publication number
20180354067
Publication date
Dec 13, 2018
Disco Corporation
Kentaro Iizuka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Cutting machine
Publication number
20020045414
Publication date
Apr 18, 2002
Kazuma Sekiya
B28 - WORKING CEMENT, CLAY, OR STONE