Naoki SEKINE

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus
- Patent number 11,961,819
- Issue date Apr 16, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,908,827
- Issue date Feb 20, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 10,566,307
- Issue date Feb 18, 2020
- Shinkawa Ltd.
- Yuu Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and wire bonding appar...
- Patent number 9,978,713
- Issue date May 22, 2018
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and method of manufacturing semiconductor de...
- Patent number 9,899,348
- Issue date Feb 20, 2018
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method, semiconductor device, an...
- Patent number 9,887,174
- Issue date Feb 6, 2018
- Shinkawa Ltd.
- Naoki Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-bonding apparatus and method of manufacturing semiconductor de...
- Patent number 9,793,236
- Issue date Oct 17, 2017
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-bonding apparatus and method of wire bonding
- Patent number 9,457,421
- Issue date Oct 4, 2016
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,379,086
- Issue date Jun 28, 2016
- Shinkawa Ltd.
- Shinji Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-bonding apparatus and method of manufacturing semiconductor de...
- Patent number 9,368,471
- Issue date Jun 14, 2016
- Shinkawa Ltd.
- Shinichi Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and bonding method
- Patent number 9,337,166
- Issue date May 10, 2016
- Shinkawa Ltd.
- Yoshihito Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20220149001
- Publication date May 12, 2022
- SHINKAWA LTD.
- Naoki SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20180323166
- Publication date Nov 8, 2018
- SHINKAWA LTD.
- Yuu HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AN...
- Publication number 20160358880
- Publication date Dec 8, 2016
- SHINKAWA LTD.
- Naoki SEKINE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20160351537
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- Naoki SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20160351535
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- Naoki SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
- Publication number 20160163673
- Publication date Jun 9, 2016
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160035695
- Publication date Feb 4, 2016
- SHINKAWA LTD.
- SHINJI KUMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE-BONDING APPARATUS AND METHOD OF WIRE BONDING
- Publication number 20150246411
- Publication date Sep 3, 2015
- SHINKAWA LTD.
- NAOKI SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20150249063
- Publication date Sep 3, 2015
- SHINKAWA LTD.
- NAOKI SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20150243627
- Publication date Aug 27, 2015
- SHINKAWA LTD.
- Shinichi AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
- Publication number 20140138426
- Publication date May 22, 2014
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS

Naoki SEKINE

Person

Patents Grantslast 30 patents

Wire bonding apparatus

Wire bonding apparatus

Manufacturing method of semiconductor device

Method of manufacturing semiconductor device and wire bonding appar...

Wire bonding apparatus and method of manufacturing semiconductor de...

Semiconductor device manufacturing method, semiconductor device, an...

Wire-bonding apparatus and method of manufacturing semiconductor de...

Wire-bonding apparatus and method of wire bonding

Method of manufacturing semiconductor device

Wire-bonding apparatus and method of manufacturing semiconductor de...

Wire bonding apparatus and bonding method

Patents Applicationslast 30 patents

WIRE BONDING APPARATUS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AN...

WIRE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

WIRE BONDING APPARATUS AND BONDING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WIRE-BONDING APPARATUS AND METHOD OF WIRE BONDING

WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...

WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...

WIRE BONDING APPARATUS AND BONDING METHOD