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Naoki SHIMOMURA

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Plating apparatus
    • Patent number 11,725,297
    • Issue date Aug 15, 2023
    • Ebara Corporation
    • Naoki Shimomura
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Regulation plate, anode holder, and substrate holder
    • Patent number 11,686,009
    • Issue date Jun 27, 2023
    • Ebara Corporation
    • Naoki Shimomura
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Substrate holder and plating device
    • Patent number 11,280,020
    • Issue date Mar 22, 2022
    • Ebara Corporation
    • Naoki Shimomura
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Regulation plate, anode holder, and substrate holder
    • Patent number 11,268,207
    • Issue date Mar 8, 2022
    • Ebara Corporation
    • Naoki Shimomura
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating apparatus and plating method
    • Patent number 11,066,755
    • Issue date Jul 20, 2021
    • Ebara Corporation
    • Naoki Shimomura
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    PLATING METHOD, INSOLUBLE ANODE FOR PLATING, AND PLATING APPARATUS
    • Publication number 20220228285
    • Publication date Jul 21, 2022
    • EBARA CORPORATION
    • Hiroyuki Kanda
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    REGULATION PLATE, ANODE HOLDER, AND SUBSTRATE HOLDER
    • Publication number 20220154363
    • Publication date May 19, 2022
    • EBARA CORPORATION
    • Naoki SHIMOMURA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20220119981
    • Publication date Apr 21, 2022
    • EBARA CORPORATION
    • Naoki Shimomura
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING METHOD, PLATING APPARATUS, ANODE HOLDER
    • Publication number 20210071312
    • Publication date Mar 11, 2021
    • EBARA CORPORATION
    • Naoki SHIMOMURA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    SUBSTRATE HOLDER AND PLATING DEVICE
    • Publication number 20210054521
    • Publication date Feb 25, 2021
    • EBARA CORPORATION
    • Naoki SHIMOMURA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    REGULATION PLATE, ANODE HOLDER, AND SUBSTRATE HOLDER
    • Publication number 20200157702
    • Publication date May 21, 2020
    • EBARA CORPORATION
    • Naoki SHIMOMURA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20190390360
    • Publication date Dec 26, 2019
    • EBARA CORPORATION
    • Naoki SHIMOMURA
    • H01 - BASIC ELECTRIC ELEMENTS