Naoki Tomori

Person

Chiba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive film production apparatus and adhesive film production method
- Patent number 12,134,534
- Issue date Nov 5, 2024
- Naoki Tomori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reel body, method for manufacturing reel body, and method for manuf...
- Patent number 12,060,239
- Issue date Aug 13, 2024
- Naoki Tomori
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Temporary protective film for semiconductor sealing molding, lead f...
- Patent number 11,908,762
- Issue date Feb 20, 2024
- Resonac Corporation
- Naoki Tomori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Temporary protective film for semiconductor encapsulation molding,...
- Patent number 11,682,564
- Issue date Jun 20, 2023
- Resonac Corporation
- Takahiro Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary protective film for semiconductor encapsulation molding,...
- Patent number 11,251,055
- Issue date Feb 15, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Takahiro Kuroda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Temporary protective film for semiconductor sealing molding
- Patent number 11,195,728
- Issue date Dec 7, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Naoki Tomori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing film and a semiconductor device using the same
- Patent number 8,771,828
- Issue date Jul 8, 2014
- Hitachi Chemical Company, Ltd.
- Hiroyuki Kawakami
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Sealing film and a semiconductor device using the same
- Patent number 8,715,454
- Issue date May 6, 2014
- Hitachi Chemical Company, Ltd.
- Hiroyuki Kawakami
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...
- Publication number 20230174828
- Publication date Jun 8, 2023
- Showa Denko Materials Co., Ltd.
- Takahiro KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY PROTECTION FILM FOR SEMICONDUCTOR ENCAPSULATION, PRODUCTI...
- Publication number 20230178385
- Publication date Jun 8, 2023
- Showa Denko Materials Co., Ltd.
- Takahiro KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REEL BODY, METHOD FOR MANUFACTURING REEL BODY, AND METHOD FOR MANUF...
- Publication number 20230043876
- Publication date Feb 9, 2023
- Showa Denko Materials Co., Ltd.
- Naoki TOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM PRODUCTION APPARATUS AND ADHESIVE FILM PRODUCTION METHOD
- Publication number 20230040595
- Publication date Feb 9, 2023
- Showa Denko Materials Co., Ltd.
- Naoki TOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM PRODUCTION APPARATUS AND REEL BODIES
- Publication number 20230039365
- Publication date Feb 9, 2023
- Showa Denko Materials Co., Ltd.
- Naoki TOMORI
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
TEMPORARY PROTECTIVE FILM, REEL BODY, PACKAGING BODY, PACKAGE BODY,...
- Publication number 20220285200
- Publication date Sep 8, 2022
- Showa Denko Materials Co., Ltd.
- Takahiro KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...
- Publication number 20220020606
- Publication date Jan 20, 2022
- Showa Denko Materials Co., Ltd.
- Takahiro KURODA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TEMPORARY PROTECTIVE FILM FOR PRODUCING SEMICONDUCTOR DEVICE, REEL...
- Publication number 20210395577
- Publication date Dec 23, 2021
- Showa Denko Materials Co., Ltd.
- Takahiro KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR SEALING MOLDING, LEAD F...
- Publication number 20210050274
- Publication date Feb 18, 2021
- Hitachi Chemical Company, Ltd.
- Naoki TOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATIONMOLDING, L...
- Publication number 20210020460
- Publication date Jan 21, 2021
- Hitachi Chemical Company, Ltd.
- Takahiro KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR SEALING MOLDING
- Publication number 20200118841
- Publication date Apr 16, 2020
- Hitachi Chemical Company, Ltd.
- Naoki TOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING FILM AND A SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20130093105
- Publication date Apr 18, 2013
- Hiroyuki KAWAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealing Film and a Semiconductor Device Using the Same
- Publication number 20090189300
- Publication date Jul 30, 2009
- Hiroyuki Kawakami
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Naoki Tomori

Person

Patents Grantslast 30 patents

Adhesive film production apparatus and adhesive film production method

Reel body, method for manufacturing reel body, and method for manuf...

Temporary protective film for semiconductor sealing molding, lead f...

Temporary protective film for semiconductor encapsulation molding,...

Temporary protective film for semiconductor encapsulation molding,...

Temporary protective film for semiconductor sealing molding

Sealing film and a semiconductor device using the same

Sealing film and a semiconductor device using the same

Patents Applicationslast 30 patents

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...

TEMPORARY PROTECTION FILM FOR SEMICONDUCTOR ENCAPSULATION, PRODUCTI...

REEL BODY, METHOD FOR MANUFACTURING REEL BODY, AND METHOD FOR MANUF...

ADHESIVE FILM PRODUCTION APPARATUS AND ADHESIVE FILM PRODUCTION METHOD

ADHESIVE FILM PRODUCTION APPARATUS AND REEL BODIES

TEMPORARY PROTECTIVE FILM, REEL BODY, PACKAGING BODY, PACKAGE BODY,...

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...

TEMPORARY PROTECTIVE FILM FOR PRODUCING SEMICONDUCTOR DEVICE, REEL...

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR SEALING MOLDING, LEAD F...

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATIONMOLDING, L...

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR SEALING MOLDING

SEALING FILM AND A SEMICONDUCTOR DEVICE USING THE SAME

Sealing Film and a Semiconductor Device Using the Same