Naoko Takeda

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Lead-free solder material having good wettability
- Patent number 6,649,127
- Issue date Nov 18, 2003
- Kazutaka Habu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy composition
- Patent number 6,361,742
- Issue date Mar 26, 2002
- Sony Corporation
- Naoko Takeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy composition
- Patent number 6,228,322
- Issue date May 8, 2001
- Sony Corporation
- Naoko Takeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method to manufacture lead-free solder material having good wettabi...
- Publication number 20020106302
- Publication date Aug 8, 2002
- Kazutaka Habu
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Solder material
- Publication number 20020009384
- Publication date Jan 24, 2002
- Kazutaka Habu
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Solder alloy composition
- Publication number 20010000321
- Publication date Apr 19, 2001
- Naoko Takeda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...