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Naoko Yamamoto
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Thermocompression bonding method for workpiece
Patent number
11,823,942
Issue date
Nov 21, 2023
Disco Corporation
Naoko Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for machining workpiece
Patent number
11,587,831
Issue date
Feb 21, 2023
Disco Corporation
Naoko Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processing method and thermocompression bonding method for workpiece
Patent number
11,222,807
Issue date
Jan 11, 2022
Disco Corporation
Naoko Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Workpiece cutting method
Patent number
11,222,822
Issue date
Jan 11, 2022
Disco Corporation
Naoko Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of chips
Patent number
11,189,530
Issue date
Nov 30, 2021
Disco Corporation
Naoko Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Workpiece processing method
Patent number
11,167,446
Issue date
Nov 9, 2021
Disco Corporation
Naoko Yamamoto
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Wafer processing method
Patent number
11,171,056
Issue date
Nov 9, 2021
Disco Corporation
Naoko Yamamoto
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Package substrate processing method
Patent number
11,101,151
Issue date
Aug 24, 2021
Disco Corporation
Kenji Takenouchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Storage control device and method of controlling storage control de...
Patent number
9,563,574
Issue date
Feb 7, 2017
Hitachi, Ltd.
Naoko Yamamoto
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR PROCESSING DEVICE WAFER
Publication number
20240079245
Publication date
Mar 7, 2024
Disco Corporation
Naoko YAMAMOTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PROCESSING METHOD
Publication number
20240006241
Publication date
Jan 4, 2024
Disco Corporation
Naoko YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE WAFER PROCESSING METHOD
Publication number
20240006239
Publication date
Jan 4, 2024
Disco Corporation
Naoko YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE WAFER PROCESSING METHOD AND PROCESSING APPARATUS
Publication number
20240006240
Publication date
Jan 4, 2024
Disco Corporation
Naoko YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING APPARATUS AND PROCESSING METHOD
Publication number
20230415206
Publication date
Dec 28, 2023
Disco Corporation
Naoko YAMAMOTO
B08 - CLEANING
Information
Patent Application
WAFER PROCESSING METHOD AND WAFER PROCESSING SYSTEM
Publication number
20230395401
Publication date
Dec 7, 2023
Disco Corporation
Yuki INOUE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INSPECTION METHOD
Publication number
20230061146
Publication date
Mar 2, 2023
Disco Corporation
Naoko YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PROCESSING A SUBSTRATE AND SYSTEM FOR PROCESSING A SUBSTRATE
Publication number
20220331899
Publication date
Oct 20, 2022
Disco Corporation
Karl Heinz PRIEWASSER
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THERMOCOMPRESSION BONDING METHOD FOR WORKPIECE
Publication number
20220059392
Publication date
Feb 24, 2022
Disco Corporation
Naoko YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WORKPIECE PROCESSING METHOD
Publication number
20210252742
Publication date
Aug 19, 2021
Disco Corporation
Naoko YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MACHINING WORKPIECE
Publication number
20210118735
Publication date
Apr 22, 2021
Disco Corporation
Naoko YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF CHIPS
Publication number
20200335396
Publication date
Oct 22, 2020
Disco Corporation
Naoko YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING METHOD AND THERMOCOMPRESSION BONDING METHOD FOR WORKPIECE
Publication number
20200335382
Publication date
Oct 22, 2020
Disco Corporation
Naoko YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WORKPIECE CUTTING METHOD
Publication number
20200227319
Publication date
Jul 16, 2020
Disco Corporation
Naoko YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE PROCESSING METHOD
Publication number
20200058525
Publication date
Feb 20, 2020
Disco Corporation
Kenji TAKENOUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER PROCESSING METHOD
Publication number
20190035689
Publication date
Jan 31, 2019
Disco Corporation
Naoko Yamamoto
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
STORAGE CONTROL DEVICE AND METHOD OF CONTROLLING STORAGE CONTROL DE...
Publication number
20150363331
Publication date
Dec 17, 2015
Hitachi, Ltd
Naoko YAMAMOTO
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Semiconductor wafer cutting method
Publication number
20020178883
Publication date
Dec 5, 2002
Naoko Yamamoto
B28 - WORKING CEMENT, CLAY, OR STONE