Naomi Masuda

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Nantong, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method for chip package
- Patent number 9,362,173
- Issue date Jun 7, 2016
- Nantong Fujitsu Microelectronics Co., Ltd.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for chip packaging
- Patent number 8,883,627
- Issue date Nov 11, 2014
- Nantong Fujitsu Microelectronics Co., Ltd.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR CHIP PACKAGING
- Publication number 20130280904
- Publication date Oct 24, 2013
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CHIP PACKAGE
- Publication number 20130224910
- Publication date Aug 29, 2013
- NANTONG FUJITSU MOCROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS