NAOMICHI OHASHI

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Mounting method and mounting structure formed by the same
- Patent number 12,028,986
- Issue date Jul 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Naomichi Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste and conductive film formed using the same
- Patent number 11,970,631
- Issue date Apr 30, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Naomichi Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste and mounting structure
- Patent number 11,618,110
- Issue date Apr 4, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Naomichi Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin fluxed solder paste, and mount structure
- Patent number 10,440,834
- Issue date Oct 8, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-dissipating resin composition, and component and electronic de...
- Patent number 10,407,604
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Honami Nawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Mounting structure and method for producing mounting structure
- Patent number 9,881,813
- Issue date Jan 30, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted structure and manufacturing method of mounted structure
- Patent number 9,603,295
- Issue date Mar 21, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method and mounting structure for semiconductor package co...
- Patent number 9,331,047
- Issue date May 3, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Naomichi Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive, and circuit board and electronic component mod...
- Patent number 8,940,198
- Issue date Jan 27, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Mounting structure of semiconductor package component and manufactu...
- Patent number 8,664,773
- Issue date Mar 4, 2014
- Panasonic Corporation
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive paste, and electrical and electronic device...
- Patent number 8,540,903
- Issue date Sep 24, 2013
- Panasonic Corporation
- Takayuki Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounted structure and its manufacturing method
- Patent number 8,450,859
- Issue date May 28, 2013
- Panasonic Corporation
- Naomichi Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste and mounting structure using the same
- Patent number 8,182,923
- Issue date May 22, 2012
- Panasonic Corporation
- Naomichi Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER PASTE AND BONDED STRUCTURE
- Publication number 20230347454
- Publication date Nov 2, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- NAOMICHI OHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PASTE AND CONDUCTIVE FILM FORMED USING THE SAME
- Publication number 20220403183
- Publication date Dec 22, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- NAOMICHI OHASHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MOUNTING METHOD AND MOUNTING STRUCTURE FORMED BY THE SAME
- Publication number 20220030721
- Publication date Jan 27, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- NAOMICHI OHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE RESIN COMPOSITION AND MOUNTING STRUCTURE
- Publication number 20210309829
- Publication date Oct 7, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- NAOMICHI OHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE AND MOUNTING STRUCTURE
- Publication number 20210129273
- Publication date May 6, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- NAOMICHI OHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE AND JOINING STRUCTURE
- Publication number 20210121992
- Publication date Apr 29, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- NAOMICHI OHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE AND MOUNT STRUCTURE
- Publication number 20190232438
- Publication date Aug 1, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- HIROHISA HINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE AND MOUNT STRUCTURE OBTAINED BY USING SAME
- Publication number 20180229333
- Publication date Aug 16, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- HIROHISA HINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLAR CELL MODULE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20170345960
- Publication date Nov 30, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- KEI TOYOTA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN FLUXED SOLDER PASTE, AND MOUNT STRUCTURE
- Publication number 20170188468
- Publication date Jun 29, 2017
- Panasonic Intellectual Property Managemtent Co., Ltd.
- HIROHISA HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE AND SOLDERING FLUX, AND MOUNTED STRUCTURE USING SAME
- Publication number 20170120396
- Publication date May 4, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- NAOMICHI OHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE AND METHOD FOR PRODUCING MOUNTING STRUCTURE
- Publication number 20170040184
- Publication date Feb 9, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- HIROHISA HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING RESIN COMPOSITION, AND COMPONENT AND ELECTRONIC DE...
- Publication number 20150327393
- Publication date Nov 12, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Honami NAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SOLAR CELL MODULE
- Publication number 20150187977
- Publication date Jul 2, 2015
- Panasonic Intellectual Property Management Co., Lt
- Hideyuki Tsujimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE CO...
- Publication number 20140120663
- Publication date May 1, 2014
- PANASONIC CORPORATION
- Naomichi Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE
- Publication number 20140049930
- Publication date Feb 20, 2014
- PANASONIC CORPORATION
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE COMPONENT AND MANUFACTU...
- Publication number 20120299202
- Publication date Nov 29, 2012
- PANASONIC CORPORATION
- Atsushi YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE, AND CIRCUIT BOARD AND ELECTRONIC COMPONENT MOD...
- Publication number 20120073869
- Publication date Mar 29, 2012
- PANASONIC CORPORATION
- Arata KISHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE CO...
- Publication number 20110108997
- Publication date May 12, 2011
- PANASONIC CORPORATION
- Naomichi Ohashi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD
- Publication number 20110095423
- Publication date Apr 28, 2011
- Naomichi Ohashi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICAL AND ELECTRONIC DEVICE...
- Publication number 20110049439
- Publication date Mar 3, 2011
- Takayuki Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device and Manufacturing Method for Electronic Device
- Publication number 20100101845
- Publication date Apr 29, 2010
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PASTE AND MOUNTING STRUCTURE USING THE SAME
- Publication number 20090269598
- Publication date Oct 29, 2009
- Naomichi OHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

NAOMICHI OHASHI

Person

Patents Grantslast 30 patents

Mounting method and mounting structure formed by the same

Conductive paste and conductive film formed using the same

Solder paste and mounting structure

Resin fluxed solder paste, and mount structure

Heat-dissipating resin composition, and component and electronic de...

Mounting structure and method for producing mounting structure

Mounted structure and manufacturing method of mounted structure

Mounting method and mounting structure for semiconductor package co...

Conductive adhesive, and circuit board and electronic component mod...

Mounting structure of semiconductor package component and manufactu...

Electrically conductive paste, and electrical and electronic device...

Semiconductor device mounted structure and its manufacturing method

Conductive paste and mounting structure using the same

Patents Applicationslast 30 patents

SOLDER PASTE AND BONDED STRUCTURE

CONDUCTIVE PASTE AND CONDUCTIVE FILM FORMED USING THE SAME

MOUNTING METHOD AND MOUNTING STRUCTURE FORMED BY THE SAME

CURABLE RESIN COMPOSITION AND MOUNTING STRUCTURE

SOLDER PASTE AND MOUNTING STRUCTURE

SOLDER PASTE AND JOINING STRUCTURE

SOLDER PASTE AND MOUNT STRUCTURE

SOLDER PASTE AND MOUNT STRUCTURE OBTAINED BY USING SAME

SOLAR CELL MODULE AND METHOD OF MANUFACTURE THEREOF

RESIN FLUXED SOLDER PASTE, AND MOUNT STRUCTURE

SOLDER PASTE AND SOLDERING FLUX, AND MOUNTED STRUCTURE USING SAME

MOUNTING STRUCTURE AND METHOD FOR PRODUCING MOUNTING STRUCTURE

HEAT-DISSIPATING RESIN COMPOSITION, AND COMPONENT AND ELECTRONIC DE...

SOLAR CELL MODULE

MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE CO...

MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE

MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE COMPONENT AND MANUFACTU...

CONDUCTIVE ADHESIVE, AND CIRCUIT BOARD AND ELECTRONIC COMPONENT MOD...

MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE CO...

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD

ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICAL AND ELECTRONIC DEVICE...

Electronic Device and Manufacturing Method for Electronic Device

CONDUCTIVE PASTE AND MOUNTING STRUCTURE USING THE SAME