Naomitsu Ozawa

Follow

Person

Kohza-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plating apparatus and method
- Patent number 6,660,139
- Issue date Dec 9, 2003
- Ebara Corporation
- Satoshi Sendai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus for detecting the conductivity between plating co...
- Patent number 6,500,317
- Issue date Dec 31, 2002
- Ebara Corporation
- Junichiro Yoshioka
- G01 - MEASURING TESTING
Information Patent Grant
Wafer plating jig
- Patent number 6,365,020
- Issue date Apr 2, 2002
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Plating apparatus and method
- Publication number 20060185976
- Publication date Aug 24, 2006
- Satoshi Sendai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and method
- Publication number 20040089555
- Publication date May 13, 2004
- Satoshi Sendai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR