Naotaka Toyama

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Gunma, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing polishing pad, and method for polishing wafer
- Patent number 8,287,331
- Issue date Oct 16, 2012
- Shin-Etsu Handotai Co., Ltd.
- Koichi Kanaya
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing method, wafer cleaning method and wafer protective...
- Patent number 6,558,233
- Issue date May 6, 2003
- Shin-Etsu Handotai Co., Ltd.
- Takashi Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece holder for polishing, apparatus for polishing workpiece a...
- Patent number 6,422,922
- Issue date Jul 23, 2002
- Shin-Etsu Handotai Co., Ltd.
- Kouichi Okamura
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece holder for polishing, method for producing the same, meth...
- Patent number 6,386,957
- Issue date May 14, 2002
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing polishing pad, polishing pad, and method f...
- Publication number 20080248728
- Publication date Oct 9, 2008
- Shin-Etsu Handotai Co., Ltd.
- Koichi Kanaya
- B24 - GRINDING POLISHING