Naoto Tate

Person

Gunma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Process for treating substrates for the microelectronics industry,...
- Patent number 7,288,418
- Issue date Oct 30, 2007
- S.O.O.Tec Silicon on Insulator Technologies
- Thierry Barge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for treating substrates for microelectronics and substrates...
- Patent number 7,029,993
- Issue date Apr 18, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Thierry Barge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a bonded wafers using a Bernoulli chuck
- Patent number 6,897,124
- Issue date May 24, 2005
- Shin-Etsu Handotai Co., Ltd.
- Naoto Tate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing SOI wafer and SOI wafer
- Patent number 6,846,718
- Issue date Jan 25, 2005
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reclaiming delaminated wafer and reclaimed delaminated w...
- Patent number 6,720,640
- Issue date Apr 13, 2004
- Shin-Etsu Handotai Co., Ltd.
- Susumu Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reclaiming delaminated wafer and reclaimed delaminated w...
- Patent number 6,596,610
- Issue date Jul 22, 2003
- Shin-Etsu Handotai Co. Ltd.
- Susumu Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon and oxygen ion co-implanation for metallic gettering in epi...
- Patent number 6,569,749
- Issue date May 27, 2003
- SEH America, Inc.
- Witawat Wijaranakula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of Fabricating SOI wafer by hydrogen ION delamination method...
- Patent number 6,372,609
- Issue date Apr 16, 2002
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an SOI wafer and SOI wafer fabricated by the...
- Patent number 6,284,629
- Issue date Sep 4, 2001
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon and oxygen ion co-implantation for metallic gettering in ep...
- Patent number 6,022,793
- Issue date Feb 8, 2000
- SEH America, Inc.
- Witawat Wijaranakula
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Process for treating substrates for the microelectronics industry,...
- Publication number 20060189102
- Publication date Aug 24, 2006
- S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES S.A.
- Thierry Barge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing bonded wafers
- Publication number 20040152283
- Publication date Aug 5, 2004
- Naoto Tate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing SOI wafer and SOI wafer
- Publication number 20040063298
- Publication date Apr 1, 2004
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for reclaiming delaminated wafer and reclaimed delaminated w...
- Publication number 20030219957
- Publication date Nov 27, 2003
- Shin-Etsu Handotai Co., Ltd.
- Susumu Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating an SOI wafer and SOI wafer fabricated by the...
- Publication number 20010046746
- Publication date Nov 29, 2001
- SHIN-ETSU HANDOTAI CO., LTD.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Process for treating substrates for the microelectronics industry,...

Method for treating substrates for microelectronics and substrates...

Method of manufacturing a bonded wafers using a Bernoulli chuck

Method for producing SOI wafer and SOI wafer

Method for reclaiming delaminated wafer and reclaimed delaminated w...

Method for reclaiming delaminated wafer and reclaimed delaminated w...

Silicon and oxygen ion co-implanation for metallic gettering in epi...

Method of Fabricating SOI wafer by hydrogen ION delamination method...

Method of fabricating an SOI wafer and SOI wafer fabricated by the...

Silicon and oxygen ion co-implantation for metallic gettering in ep...

Patents Applicationslast 30 patents

Process for treating substrates for the microelectronics industry,...

Method for manufacturing bonded wafers

Method for producing SOI wafer and SOI wafer

Method for reclaiming delaminated wafer and reclaimed delaminated w...

Method of fabricating an SOI wafer and SOI wafer fabricated by the...