Naoto Ueda

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device constituting a CMOS camera system
- Patent number 6,768,516
- Issue date Jul 27, 2004
- Renesas Technology Corp.
- Satoshi Yamada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device
- Patent number 6,130,484
- Issue date Oct 10, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Hideo Kameda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame including frame-cutting slit for lead-on-chip (LOC) semi...
- Patent number 5,900,582
- Issue date May 4, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe including frame-cutting slit for lead-on-chip (LOC) semic...
- Patent number 5,763,829
- Issue date Jun 9, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making leadframe for lead-on-chip (LOC) semiconductor device
- Patent number 5,724,726
- Issue date Mar 10, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number RE35496
- Issue date Apr 29, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Ken Yamamura
- 174 - Electricity: conductors and insulators
Information Patent Grant
Solder material, junctioning method, junction material, and semicon...
- Patent number 5,609,287
- Issue date Mar 11, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Goro Izuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a lead on chip (LOC) semiconductor device
- Patent number 5,535,509
- Issue date Jul 16, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 5,508,232
- Issue date Apr 16, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material, junctioning method, junction material, and semicon...
- Patent number 5,372,295
- Issue date Dec 13, 1994
- Ryoden Semiconductor System Engineering Corporation
- Shunichi Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 5,334,803
- Issue date Aug 2, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Ken Yamamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of die bonding semiconductor chip
- Patent number 5,242,099
- Issue date Sep 7, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Naoto Ueda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device constituting a CMOS camera system
- Publication number 20010050717
- Publication date Dec 13, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Satoshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device constituting a CMOS camera system

Semiconductor device

Lead frame including frame-cutting slit for lead-on-chip (LOC) semi...

Leadframe including frame-cutting slit for lead-on-chip (LOC) semic...

Method of making leadframe for lead-on-chip (LOC) semiconductor device

Semiconductor device and method of producing the same

Solder material, junctioning method, junction material, and semicon...

Method of making a lead on chip (LOC) semiconductor device

Method of manufacturing a semiconductor device

Solder material, junctioning method, junction material, and semicon...

Semiconductor device and method of producing the same

Method of die bonding semiconductor chip

Patents Applicationslast 30 patents

Semiconductor device constituting a CMOS camera system