Naotomi Takahashi

Person

Ageo-shi Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Copper foil and metal foil with carrier foil for printed wiring boa...
- Patent number 6,902,824
- Issue date Jun 7, 2005
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate for forming capacitor layer and method for manufacturing t...
- Patent number 6,839,219
- Issue date Jan 4, 2005
- Mitsui Mining & Smelting Co., Ltd.
- Yasuaki Mashiko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing process for printed wiring board
- Patent number 6,716,572
- Issue date Apr 6, 2004
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board comprising electrodep...
- Patent number 6,660,406
- Issue date Dec 9, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic copper foil with carrier foil and copper-clad laminate...
- Patent number 6,649,274
- Issue date Nov 18, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Sakiko Taenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filtration method of copper electrolyte
- Patent number 6,616,827
- Issue date Sep 9, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Kazuyoshi Nabekura
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Surface-treated copper foil and method for producing the same
- Patent number 6,605,369
- Issue date Aug 12, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Naotomi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a surface-treated copper foil
- Patent number 6,585,877
- Issue date Jul 1, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing a surface-treated copper foil
- Patent number 6,579,437
- Issue date Jun 17, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil for printed wiring board
- Patent number 6,544,664
- Issue date Apr 8, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Naotomi Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface-treated copper foil, method of producing the surface-treate...
- Patent number 6,533,915
- Issue date Mar 18, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface-treated copper foil, method of producing the surface-treate...
- Patent number 6,531,045
- Issue date Mar 11, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrodeposited copper foil, method of inspecting physical propert...
- Patent number 6,479,170
- Issue date Nov 12, 2002
- Mitsui Mining & Smelting Co., Ltd.
- Naotomi Takahashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for winding copper foil on core tube
- Patent number 6,478,247
- Issue date Nov 12, 2002
- Mitsui Mining & Smelting Co., Ltd.
- Kazuhisa Fujiwara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Copper foil for printed circuit boards
- Patent number 6,322,904
- Issue date Nov 27, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Makoto Dobashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for surface treatment of copper product
- Patent number 4,640,747
- Issue date Feb 3, 1987
- Mitsui Mining and Smelting Co., Ltd.
- Kuniki Ueno
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Laminate for forming capacitor layer and method for manufacturing t...
- Publication number 20040053020
- Publication date Mar 18, 2004
- Yasuaki Mashiko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Blade for cutting copper foil
- Publication number 20030150308
- Publication date Aug 14, 2003
- Satoru Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface treated copper foil, electrodeposited copper foil with carr...
- Publication number 20030148136
- Publication date Aug 7, 2003
- Mitsui Mining & Smelting Co. Ltd.
- Takuya Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Manufacturing process for printed wiring board
- Publication number 20020081530
- Publication date Jun 27, 2002
- MITSUI MINING AND SMELTING CO., LTD
- Takuya Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Copper foil and metal foil with carrier foil for printed wiring boa...
- Publication number 20020079133
- Publication date Jun 27, 2002
- Mitsui Mining & Smelting Co. Ltd.
- Takuya Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Cathode electrode material and rotating cathode drum for electrolyt...
- Publication number 20020064019
- Publication date May 30, 2002
- Makoto Dobashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for winding copper foil on core tube
- Publication number 20020027179
- Publication date Mar 7, 2002
- Kazuhisa Fujiwara
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Manufacturing method of electrodeposited copper foil and electrodep...
- Publication number 20020015833
- Publication date Feb 7, 2002
- Naotomi Takahashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil circuit with a carrier, method for manufacturing printe...
- Publication number 20020004124
- Publication date Jan 10, 2002
- Yutaka Hirasawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method for manufacturing printed wiring board comprising electrodep...
- Publication number 20020004123
- Publication date Jan 10, 2002
- Takuya Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Filtration method of copper electrolyte
- Publication number 20010042688
- Publication date Nov 22, 2001
- MITSUI MINING AND SMELTING CO., LTD
- Kazuyoshi Nabekura
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Surface-treated copper foil, method of producing the surface-treate...
- Publication number 20010014407
- Publication date Aug 16, 2001
- MITSUI MINING AND SMELTING CO., LTD
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Surface-treated copper foil, method of producing the surface-treate...
- Publication number 20010014410
- Publication date Aug 16, 2001
- MITSUI MINING AND SMELTING CO., LTD
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Surface-treated copper foil, method of producing the surface-treate...
- Publication number 20010014406
- Publication date Aug 16, 2001
- MITSUI MINING AND SMELTING CO., LTD
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Surface -treated copper foil, method of producing the surface-treat...
- Publication number 20010014408
- Publication date Aug 16, 2001
- Mitsui Mining & Smelting Co. Ltd.
- Masakazu Mitsuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrodeposited copper foil, method of inspecting physical propert...
- Publication number 20010008091
- Publication date Jul 19, 2001
- Naotomi Takahashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Naotomi Takahashi

Person

Patents Grantslast 30 patents

Copper foil and metal foil with carrier foil for printed wiring boa...

Laminate for forming capacitor layer and method for manufacturing t...

Manufacturing process for printed wiring board

Method for manufacturing printed wiring board comprising electrodep...

Electrolytic copper foil with carrier foil and copper-clad laminate...

Filtration method of copper electrolyte

Surface-treated copper foil and method for producing the same

Method of producing a surface-treated copper foil

Method of producing a surface-treated copper foil

Copper foil for printed wiring board

Surface-treated copper foil, method of producing the surface-treate...

Surface-treated copper foil, method of producing the surface-treate...

Electrodeposited copper foil, method of inspecting physical propert...

Method for winding copper foil on core tube

Copper foil for printed circuit boards

Process for surface treatment of copper product

Patents Applicationslast 30 patents

Laminate for forming capacitor layer and method for manufacturing t...

Blade for cutting copper foil

Surface treated copper foil, electrodeposited copper foil with carr...

Manufacturing process for printed wiring board

Copper foil and metal foil with carrier foil for printed wiring boa...

Cathode electrode material and rotating cathode drum for electrolyt...

Method for winding copper foil on core tube

Manufacturing method of electrodeposited copper foil and electrodep...

Copper foil circuit with a carrier, method for manufacturing printe...

Method for manufacturing printed wiring board comprising electrodep...

Filtration method of copper electrolyte

Surface-treated copper foil, method of producing the surface-treate...

Surface-treated copper foil, method of producing the surface-treate...

Surface-treated copper foil, method of producing the surface-treate...

Surface -treated copper foil, method of producing the surface-treat...

Electrodeposited copper foil, method of inspecting physical propert...