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Naotoshi Kirihara

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Laser processing method
    • Patent number 11,833,608
    • Issue date Dec 5, 2023
    • Disco Corporation
    • Naotoshi Kirihara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing apparatus
    • Patent number 10,692,740
    • Issue date Jun 23, 2020
    • Disco Corporation
    • Naotoshi Kirihara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing apparatus
    • Patent number 10,658,171
    • Issue date May 19, 2020
    • Disco Corporation
    • Naotoshi Kirihara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing method for wafer
    • Patent number 10,573,559
    • Issue date Feb 25, 2020
    • Disco Corporation
    • Naotoshi Kirihara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing apparatus
    • Patent number 10,388,508
    • Issue date Aug 20, 2019
    • Disco Corporation
    • Naotoshi Kirihara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of processing wafer
    • Patent number 10,297,710
    • Issue date May 21, 2019
    • Disco Corporation
    • Naotoshi Kirihara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Optical device wafer processing method
    • Patent number 10,109,527
    • Issue date Oct 23, 2018
    • Disco Corporation
    • Ryugo Oba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser beam spot shape detection method
    • Patent number 9,789,567
    • Issue date Oct 17, 2017
    • Disco Corporation
    • Kenji Asano
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Processing method of optical device wafer
    • Patent number 9,761,492
    • Issue date Sep 12, 2017
    • Disco Corporation
    • Takumi Shotokuji
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer divider and wafer division method
    • Patent number 9,472,459
    • Issue date Oct 18, 2016
    • Disco Corporation
    • Naotoshi Kirihara
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Grant

    Wafer dividing method using laser beam with an annular spot
    • Patent number 7,585,751
    • Issue date Sep 8, 2009
    • Disco Corporation
    • Naotoshi Kirihara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Laser ionization mass spectroscope
    • Patent number 7,521,671
    • Issue date Apr 21, 2009
    • Kabushiki Kaisha IDX Technologies
    • Naotoshi Kirihara
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
    • Publication number 20240227083
    • Publication date Jul 11, 2024
    • Disco Corporation
    • Naotoshi KIRIHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20240139864
    • Publication date May 2, 2024
    • Disco Corporation
    • Hiroshi MORIKAZU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
    • Publication number 20240139863
    • Publication date May 2, 2024
    • Disco Corporation
    • Naotoshi KIRIHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
    • Publication number 20240131629
    • Publication date Apr 25, 2024
    • Disco Corporation
    • Naotoshi KIRIHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
    • Publication number 20240123546
    • Publication date Apr 18, 2024
    • Disco Corporation
    • Naotoshi KIRIHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING MACHINE
    • Publication number 20240082951
    • Publication date Mar 14, 2024
    • Disco Corporation
    • Naotoshi KIRIHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD
    • Publication number 20220288719
    • Publication date Sep 15, 2022
    • Disco Corporation
    • Naotoshi KIRIHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING APPARATUS
    • Publication number 20190252179
    • Publication date Aug 15, 2019
    • Disco Corporation
    • Naotoshi Kirihara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE WITH LASER BEAM
    • Publication number 20190217419
    • Publication date Jul 18, 2019
    • Disco Corporation
    • Naotoshi KIRIHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD FOR WAFER
    • Publication number 20190164833
    • Publication date May 30, 2019
    • Disco Corporation
    • Naotoshi Kirihara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20180309018
    • Publication date Oct 25, 2018
    • Disco Corporation
    • Naotoshi Kirihara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20170330774
    • Publication date Nov 16, 2017
    • Disco Corporation
    • Naotoshi Kirihara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING APPARATUS
    • Publication number 20170323774
    • Publication date Nov 9, 2017
    • Disco Corporation
    • Naotoshi Kirihara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING METHOD OF OPTICAL DEVICE WAFER
    • Publication number 20170103921
    • Publication date Apr 13, 2017
    • Disco Corporation
    • Takumi Shotokuji
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL DEVICE WAFER PROCESSING METHOD
    • Publication number 20170098579
    • Publication date Apr 6, 2017
    • Disco Corporation
    • Ryugo Oba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER DIVIDER AND WAFER DIVISION METHOD
    • Publication number 20160247723
    • Publication date Aug 25, 2016
    • Disco Corporation
    • Naotoshi Kirihara
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    LASER BEAM SPOT SHAPE DETECTION METHOD
    • Publication number 20160045980
    • Publication date Feb 18, 2016
    • Disco Corporation
    • Kenji Asano
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    OPTICAL DEVICE AND MANUFACTURING METHOD THEREFOR
    • Publication number 20150214432
    • Publication date Jul 30, 2015
    • Disco Corporation
    • Naotoshi Kirihara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER DIVIDING METHOD USING LASER BEAM WITH AN ANNULAR SPOT
    • Publication number 20090017600
    • Publication date Jan 15, 2009
    • Disco Corporation
    • Naotoshi Kirihara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of Analyzing Dioxins
    • Publication number 20080131973
    • Publication date Jun 5, 2008
    • Naotoshi Kirihara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Laser Ionization Mass Spectroscope
    • Publication number 20070272849
    • Publication date Nov 29, 2007
    • Naotoshi Kirihara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of analyzing dioxins
    • Publication number 20070108391
    • Publication date May 17, 2007
    • Toru Shiomitsu
    • G01 - MEASURING TESTING