Naoya Kitamura

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Low-EMI electronic apparatus, low-EMI circuit board, and method of...
- Patent number 6,707,682
- Issue date Mar 16, 2004
- Hitachi, Ltd.
- Yutaka Akiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer wiring substrate and manufacturing method thereof
- Patent number 6,506,982
- Issue date Jan 14, 2003
- Hitachi, Ltd.
- Hidetaka Shigi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-EMI electronic apparatus, low-EMI circuit board, and method of...
- Patent number 6,353,540
- Issue date Mar 5, 2002
- Hitachi, Ltd.
- Yutaka Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board fabricating method
- Patent number 5,480,048
- Issue date Jan 2, 1996
- Hitachi, Ltd.
- Naoya Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a thin film multilayer wiring board
- Patent number 5,393,406
- Issue date Feb 28, 1995
- Hitachi, Ltd.
- Hitoshi Yokono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating an interconnected multilayer board
- Patent number 5,388,328
- Issue date Feb 14, 1995
- Hitachi, Ltd.
- Hitoshi Yokono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnected multilayer boards and fabrication processes thereof
- Patent number 5,300,735
- Issue date Apr 5, 1994
- Hitachi, Ltd.
- Hitoshi Yokono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-layer wiring substrate and manufacturing method thereof
- Publication number 20030019663
- Publication date Jan 30, 2003
- Hidetaka Shigi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-EMI electronic apparatus, low-EMI circuit board, and method of...
- Publication number 20020015293
- Publication date Feb 7, 2002
- Yutaka Akiba
- H01 - BASIC ELECTRIC ELEMENTS

Naoya Kitamura

Person

Patents Grantslast 30 patents

Low-EMI electronic apparatus, low-EMI circuit board, and method of...

Multi-layer wiring substrate and manufacturing method thereof

Low-EMI electronic apparatus, low-EMI circuit board, and method of...

Multilayer wiring board fabricating method

Method of producing a thin film multilayer wiring board

Process for fabricating an interconnected multilayer board

Interconnected multilayer boards and fabrication processes thereof

Patents Applicationslast 30 patents

Multi-layer wiring substrate and manufacturing method thereof

Low-EMI electronic apparatus, low-EMI circuit board, and method of...