Naoya Matsushita

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Urawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of electrodeposited copper foil
- Patent number 6,444,112
- Issue date Sep 3, 2002
- Mitsui Mining & Smelting Co., Ltd.
- Nobuyuki Imada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR