Naoya Saiki

Person

Koshigaya-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Protective film forming film, protective film forming sheet and wor...
- Patent number 10,510,578
- Issue date Dec 17, 2019
- Lintec Corporation
- Naoya Saiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective film-forming film and method of manufacturing semiconduc...
- Patent number 10,190,017
- Issue date Jan 29, 2019
- Lintec Corporation
- Ken Takano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composite sheet for forming protective film
- Patent number 10,030,174
- Issue date Jul 24, 2018
- Lintec Corporation
- Hiroyuki Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-bonding layer formation film, processed product having die-bond...
- Patent number 9,953,946
- Issue date Apr 24, 2018
- Lintec Corporation
- Yuichiro Azuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, adhesive sheet and production process for sem...
- Patent number 9,562,179
- Issue date Feb 7, 2017
- Lintec Corporation
- Naoya Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, adhesive sheet and production process for sem...
- Patent number 9,184,082
- Issue date Nov 10, 2015
- Lintec Corporation
- Naoya Saiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for manufacturing semiconductor devices
- Patent number 8,545,663
- Issue date Oct 1, 2013
- Lintec Corporation
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition and adhesive sheet
- Patent number 8,247,503
- Issue date Aug 21, 2012
- Lintec Corporation
- Naoya Saiki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Marking method and sheet for both protective film forming and dicing
- Patent number 7,935,574
- Issue date May 3, 2011
- Lintec Corporation
- Naoya Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, adhesive sheet and production method of semic...
- Patent number 7,851,335
- Issue date Dec 14, 2010
- Lintec Corporation
- Isao Ichikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition, adhesive sheet and production process for sem...
- Patent number 7,842,551
- Issue date Nov 30, 2010
- Lintec Corporation
- Naoya Saiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition and adhesive sheet
- Patent number 7,674,859
- Issue date Mar 9, 2010
- Lintec Corporation
- Naoya Saiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
PROTECTIVE FILM-FORMING FILM AND METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20170121552
- Publication date May 4, 2017
- LINTEC CORPORATION
- Ken Takano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROTECTIVE FILM FORMING FILM, PROTECTIVE FILM FORMING SHEET AND WOR...
- Publication number 20170011949
- Publication date Jan 12, 2017
- LINTEC CORPORATION
- Naoya Saiki
- B32 - LAYERED PRODUCTS
Information Patent Application
DIE-BONDING LAYER FORMATION FILM, PROCESSED PRODUCT HAVING DIE-BOND...
- Publication number 20170005062
- Publication date Jan 5, 2017
- LINTEC CORPORATION
- Yuichiro AZUMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Composite Sheet For Protective-Film Formation
- Publication number 20160326403
- Publication date Nov 10, 2016
- LINTEC CORPORATION
- Hiroyuki Yoneyama
- B32 - LAYERED PRODUCTS
Information Patent Application
Protective Film Formation-Use Composite Sheet
- Publication number 20160185089
- Publication date Jun 30, 2016
- LINTEC CORPORATION
- Hiroyuki Yoneyama
- B32 - LAYERED PRODUCTS
Information Patent Application
Protective Film Formation-Use Composite Sheet
- Publication number 20160176169
- Publication date Jun 23, 2016
- Hiroyuki Yoneyama
- B32 - LAYERED PRODUCTS
Information Patent Application
Protective Film Forming Film, Sheet For Forming Protective Film, an...
- Publication number 20160167345
- Publication date Jun 16, 2016
- LINTEC CORPORATION
- Naoya Saiki
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE AGENT COMPOSITION, ADHESIVE SHEET, AND METHOD FOR MANUFACT...
- Publication number 20160086908
- Publication date Mar 24, 2016
- LINTEC CORPORATION
- Sayaka Tsuchiyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITE SHEET FOR FORMING PROTECTIVE FILM
- Publication number 20160046840
- Publication date Feb 18, 2016
- Lintec Corporation
- Hiroyuki YONEYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive Composition, Adhesive Sheet And Production Process For Sem...
- Publication number 20160017188
- Publication date Jan 21, 2016
- LINTEC CORPORATION
- Naoya Saiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive Composition, Adhesive Sheet and Production Method of Semic...
- Publication number 20090246913
- Publication date Oct 1, 2009
- LINTEC CORPORATION
- Isao Ichikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive Composition, Adhesive Sheet and Production Method of Semic...
- Publication number 20090246915
- Publication date Oct 1, 2009
- LINTEC CORPORATION
- Isao Ichikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive Sheet for Dicing and Die Bonding
- Publication number 20090220783
- Publication date Sep 3, 2009
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive Composition, Adhesive Sheet and Production Process for Sem...
- Publication number 20090170284
- Publication date Jul 2, 2009
- LINTEC CORPORATION
- Naoya Saiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Sheet for Forming a Protective Film for Chips
- Publication number 20090053518
- Publication date Feb 26, 2009
- LINTEC CORPORATION
- Naoya Saiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive Composition, Adhesive Sheet and Production Process for Sem...
- Publication number 20090004829
- Publication date Jan 1, 2009
- LINTEC CORPORATION
- Naoya Saiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor De...
- Publication number 20080241995
- Publication date Oct 2, 2008
- SHARP KABUSHIKI KAISHA
- Yasuki Fukui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive Composition, Adhesive Sheet and Production Process for Sem...
- Publication number 20080242058
- Publication date Oct 2, 2008
- LINTEC CORPORATION
- Isao Ichikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive Composition, Adhesive Sheet and Production Process for Sem...
- Publication number 20080124839
- Publication date May 29, 2008
- LINTEC CORPORATION
- Naoya Saiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Process for manufacturing process of semiconductor device
- Publication number 20080066856
- Publication date Mar 20, 2008
- LINTEC CORPORATION
- Osamu YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive composition, adhesive sheet and production process for sem...
- Publication number 20070276079
- Publication date Nov 29, 2007
- Lintec Corporation
- Naoya Saiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Hardenable pressure sensitive adhesive sheet for dicing/die-bonding...
- Publication number 20060252234
- Publication date Nov 9, 2006
- LINTEC CORPORATION
- Naoya Saiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Marking method and sheet for both protective film forming and dicing
- Publication number 20060102987
- Publication date May 18, 2006
- LINTEC CORPORATION
- Naoya Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hardenable pressure-sensitive adhesive sheet for semiconductor and...
- Publication number 20050208296
- Publication date Sep 22, 2005
- LINTEC CORPORATION
- Naoya Saiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Naoya Saiki

Person

Patents Grantslast 30 patents

Protective film forming film, protective film forming sheet and wor...

Protective film-forming film and method of manufacturing semiconduc...

Composite sheet for forming protective film

Die-bonding layer formation film, processed product having die-bond...

Adhesive composition, adhesive sheet and production process for sem...

Adhesive composition, adhesive sheet and production process for sem...

Process for manufacturing semiconductor devices

Adhesive composition and adhesive sheet

Marking method and sheet for both protective film forming and dicing

Adhesive composition, adhesive sheet and production method of semic...

Adhesive composition, adhesive sheet and production process for sem...

Adhesive composition and adhesive sheet

Patents Applicationslast 30 patents

PROTECTIVE FILM-FORMING FILM AND METHOD OF MANUFACTURING SEMICONDUC...

PROTECTIVE FILM FORMING FILM, PROTECTIVE FILM FORMING SHEET AND WOR...

DIE-BONDING LAYER FORMATION FILM, PROCESSED PRODUCT HAVING DIE-BOND...

Composite Sheet For Protective-Film Formation

Protective Film Formation-Use Composite Sheet

Protective Film Formation-Use Composite Sheet

Protective Film Forming Film, Sheet For Forming Protective Film, an...

ADHESIVE AGENT COMPOSITION, ADHESIVE SHEET, AND METHOD FOR MANUFACT...

COMPOSITE SHEET FOR FORMING PROTECTIVE FILM

Adhesive Composition, Adhesive Sheet And Production Process For Sem...

Adhesive Composition, Adhesive Sheet and Production Method of Semic...

Adhesive Composition, Adhesive Sheet and Production Method of Semic...

Adhesive Sheet for Dicing and Die Bonding

Adhesive Composition, Adhesive Sheet and Production Process for Sem...

Sheet for Forming a Protective Film for Chips

Adhesive Composition, Adhesive Sheet and Production Process for Sem...

Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor De...

Adhesive Composition, Adhesive Sheet and Production Process for Sem...

Adhesive Composition, Adhesive Sheet and Production Process for Sem...

Process for manufacturing process of semiconductor device

Adhesive composition, adhesive sheet and production process for sem...

Hardenable pressure sensitive adhesive sheet for dicing/die-bonding...

Marking method and sheet for both protective film forming and dicing

Hardenable pressure-sensitive adhesive sheet for semiconductor and...