Naoya SATO

Person

Sakata, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Joint structure, piezoelectric device, liquid ejecting head, liquid...
- Patent number 10,093,094
- Issue date Oct 9, 2018
- Seiko Epson Corporation
- Naoya Sato
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid ejecting head and liquid ejecting apparatus
- Patent number 9,840,076
- Issue date Dec 12, 2017
- Seiko Epson Corporation
- Hiroaki Okui
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electronic device, and method for manufacturing electronic device
- Patent number 9,789,688
- Issue date Oct 17, 2017
- Seiko Epson Corporation
- Naoya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric device, liquid ejecting head and method for manufactu...
- Patent number 9,751,306
- Issue date Sep 5, 2017
- Seiko Epson Corporation
- Naoya Sato
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor module and method of producing the same
- Patent number 7,986,046
- Issue date Jul 26, 2011
- Seiko Epson Corporation
- Akihito Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 7,893,543
- Issue date Feb 22, 2011
- Seiko Epson Corporation
- Akihito Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring board
- Patent number 7,257,892
- Issue date Aug 21, 2007
- Seiko Epson Corporation
- Naoya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
JOINT STRUCTURE, PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, LIQUID...
- Publication number 20180056655
- Publication date Mar 1, 2018
- SEIKO EPSON CORPORATION
- Naoya SATO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD AND METHOD FOR MANUFACTU...
- Publication number 20170028726
- Publication date Feb 2, 2017
- SEIKO EPSON CORPORATION
- Naoya SATO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20160271951
- Publication date Sep 22, 2016
- SEIKO EPSON CORPORATION
- Naoya SATO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE
- Publication number 20160257101
- Publication date Sep 8, 2016
- SEIKO EPSON CORPORATION
- Naoya SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
- Publication number 20160031214
- Publication date Feb 4, 2016
- SEIKO EPSON CORPORATION
- Hiroaki OKUI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20090218674
- Publication date Sep 3, 2009
- SEIKO EPSON CORPORATION
- Akihito NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF PRODUCING THE SAME
- Publication number 20090218685
- Publication date Sep 3, 2009
- SEIKO EPSON CORPORATION
- Akihito NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing wiring board
- Publication number 20060185163
- Publication date Aug 24, 2006
- Seiko Epson Corporation
- Naoya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing wiring board
- Publication number 20060013947
- Publication date Jan 19, 2006
- Satoru Akatsuka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Joint structure, piezoelectric device, liquid ejecting head, liquid...

Liquid ejecting head and liquid ejecting apparatus

Electronic device, and method for manufacturing electronic device

Piezoelectric device, liquid ejecting head and method for manufactu...

Semiconductor module and method of producing the same

Semiconductor module

Method of manufacturing wiring board

Patents Applicationslast 30 patents

JOINT STRUCTURE, PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, LIQUID...

PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD AND METHOD FOR MANUFACTU...

ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE

LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE AND METHOD OF PRODUCING THE SAME

Method of manufacturing wiring board

Method for manufacturing wiring board