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Naoya Sukegawa

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  • Ota-ku, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Polishing tool
    • Patent number 12,304,024
    • Issue date May 20, 2025
    • Disco Corporation
    • Naruto Fuwa
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Workpiece evaluating method
    • Patent number 10,157,802
    • Issue date Dec 18, 2018
    • Disco Corporation
    • Naoya Sukegawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of evaluating gettering property
    • Patent number 10,068,811
    • Issue date Sep 4, 2018
    • Disco Corporation
    • Naoya Sukegawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Evaluation method of device wafer
    • Patent number 9,679,820
    • Issue date Jun 13, 2017
    • Disco Corporation
    • Naoya Sukegawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor wafer processing method
    • Patent number 7,731,567
    • Issue date Jun 8, 2010
    • Disco Corporation
    • Shinnosuke Sekiya
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    POLISHING TOOL
    • Publication number 20220395957
    • Publication date Dec 15, 2022
    • Disco Corporation
    • Naruto Fuwa
    • B24 - GRINDING POLISHING
  • Information Patent Application

    METHOD OF EVALUATING GETTERING PROPERTY
    • Publication number 20170338158
    • Publication date Nov 23, 2017
    • Disco Corporation
    • Naoya Sukegawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WORKPIECE EVALUATING METHOD
    • Publication number 20170278759
    • Publication date Sep 28, 2017
    • Disco Corporation
    • Naoya Sukegawa
    • G01 - MEASURING TESTING
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20150380283
    • Publication date Dec 31, 2015
    • Disco Corporation
    • Naoya Sukegawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EVALUATION METHOD OF DEVICE WAFER
    • Publication number 20150377779
    • Publication date Dec 31, 2015
    • Disco Corporation
    • Naoya Sukegawa
    • G01 - MEASURING TESTING
  • Information Patent Application

    Semiconductor wafer processing method
    • Publication number 20080076329
    • Publication date Mar 27, 2008
    • Disco Corporation
    • Shinnosuke Sekiya
    • H01 - BASIC ELECTRIC ELEMENTS