Naoya Sukegawa

Follow

Person

Ota-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Workpiece evaluating method
- Patent number 10,157,802
- Issue date Dec 18, 2018
- Disco Corporation
- Naoya Sukegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of evaluating gettering property
- Patent number 10,068,811
- Issue date Sep 4, 2018
- Disco Corporation
- Naoya Sukegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Evaluation method of device wafer
- Patent number 9,679,820
- Issue date Jun 13, 2017
- Disco Corporation
- Naoya Sukegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer processing method
- Patent number 7,731,567
- Issue date Jun 8, 2010
- Disco Corporation
- Shinnosuke Sekiya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POLISHING TOOL
- Publication number 20220395957
- Publication date Dec 15, 2022
- Disco Corporation
- Naruto Fuwa
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF EVALUATING GETTERING PROPERTY
- Publication number 20170338158
- Publication date Nov 23, 2017
- Disco Corporation
- Naoya Sukegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE EVALUATING METHOD
- Publication number 20170278759
- Publication date Sep 28, 2017
- Disco Corporation
- Naoya Sukegawa
- G01 - MEASURING TESTING
Information Patent Application
PROCESSING APPARATUS
- Publication number 20150380283
- Publication date Dec 31, 2015
- Disco Corporation
- Naoya Sukegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EVALUATION METHOD OF DEVICE WAFER
- Publication number 20150377779
- Publication date Dec 31, 2015
- Disco Corporation
- Naoya Sukegawa
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor wafer processing method
- Publication number 20080076329
- Publication date Mar 27, 2008
- Disco Corporation
- Shinnosuke Sekiya
- H01 - BASIC ELECTRIC ELEMENTS