Naoya Suzuki

Person

Tsukuba-shi Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Packet flow monitoring device, packet data extraction device, extra...
- Patent number 11,528,202
- Issue date Dec 13, 2022
- INTELLIGENT WAVE INC
- Tomofumi Koyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor element mounting structure, and combination of semico...
- Patent number 11,444,054
- Issue date Sep 13, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hitoshi Onozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device
- Patent number 11,049,825
- Issue date Jun 29, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Aya Kasahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,629,457
- Issue date Apr 21, 2020
- Hitachi Chemical Company, Ltd.
- Takashi Kawamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow film, solder bump formation method, solder joint formation m...
- Patent number 9,656,353
- Issue date May 23, 2017
- Hitachi Chemical Company, Ltd.
- Kazuhiro Miyauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin-sealed semiconductor device, and die bonding material and sea...
- Patent number 6,774,501
- Issue date Aug 10, 2004
- Hitachi Chemical Co., Ltd.
- Kazuhiko Kurafuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,611,064
- Issue date Aug 26, 2003
- Hitachi Chemical Company, Ltd.
- Takashi Kousaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED...
- Publication number 20240018306
- Publication date Jan 18, 2024
- RESONAC CORPORATION
- Satoshi YONEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...
- Publication number 20230268195
- Publication date Aug 24, 2023
- Resonac Corporation
- Tomoaki SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGES
- Publication number 20230207334
- Publication date Jun 29, 2023
- Shizu FUKUZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USING A BUFFER SHEET
- Publication number 20230095879
- Publication date Mar 30, 2023
- Showa Denko Materials Co., Ltd.
- Yuta Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKET FLOW MONITORING DEVICE, PACKET DATA EXTRACTION DEVICE, EXTRA...
- Publication number 20210359923
- Publication date Nov 18, 2021
- INTELLIGENT WAVE INC.
- Tomofumi KOYAMA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, AND COMBINATION OF SEMICO...
- Publication number 20200273837
- Publication date Aug 27, 2020
- Hitachi Chemical Company, Ltd.
- Hitoshi ONOZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20200194391
- Publication date Jun 18, 2020
- Hitachi Chemical Company, Ltd.
- Aya KASAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER SHEET COMPOSITION AND BUFFER SHEET
- Publication number 20180340056
- Publication date Nov 29, 2018
- Hitachi Chemical Company, Ltd.
- Yuta Koseki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150118792
- Publication date Apr 30, 2015
- Hitachi Chemical Company, Ltd.
- Takashi Kawamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION M...
- Publication number 20140252607
- Publication date Sep 11, 2014
- Hitachi Chemical Company, Ltd.
- Kazuhiro Miyauchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Resin-sealed semiconductor device, and die bonding material and sea...
- Publication number 20040000728
- Publication date Jan 1, 2004
- Kazuhiko Kurafuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Naoya Suzuki

Person

Patents Grantslast 30 patents

Packet flow monitoring device, packet data extraction device, extra...

Semiconductor element mounting structure, and combination of semico...

Method for producing semiconductor device

Method for manufacturing semiconductor device

Reflow film, solder bump formation method, solder joint formation m...

Resin-sealed semiconductor device, and die bonding material and sea...

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED...

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...

PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGES

METHOD FOR USING A BUFFER SHEET

PACKET FLOW MONITORING DEVICE, PACKET DATA EXTRACTION DEVICE, EXTRA...

SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, AND COMBINATION OF SEMICO...

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

BUFFER SHEET COMPOSITION AND BUFFER SHEET

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION M...

Resin-sealed semiconductor device, and die bonding material and sea...