Naoya Take

Person

Canton, MI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cooling chip structures having a jet impingement system and assembl...
- Patent number 11,121,061
- Issue date Sep 14, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics modules including integrated jet cooling
- Patent number 11,101,193
- Issue date Aug 24, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic assemblies with solder layer and exterior coating,...
- Patent number 10,903,186
- Issue date Jan 26, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics modules including an integrated cooling channel e...
- Patent number 10,896,865
- Issue date Jan 19, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulated stress mitigation layer and power electronic assemblie...
- Patent number 10,879,209
- Issue date Dec 29, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies having a mesh bond material and methods of fo...
- Patent number 10,861,816
- Issue date Dec 8, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-healing metal structures
- Patent number 10,830,544
- Issue date Nov 10, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Methods of forming power electronic assemblies using metal inverse...
- Patent number 10,818,576
- Issue date Oct 27, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic assemblies with high purity aluminum plated substr...
- Patent number 10,804,236
- Issue date Oct 13, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling devices including jet cooling with an intermediate mesh and...
- Patent number 10,743,442
- Issue date Aug 11, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Encapsulated stress mitigation layer and power electronic assemblie...
- Patent number 10,700,036
- Issue date Jun 30, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling devices having large surface area structures, systems incor...
- Patent number 10,515,871
- Issue date Dec 24, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Encapsulated PCM switching devices and methods of forming the same
- Patent number 10,505,106
- Issue date Dec 10, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling devices including jet cooling with an intermediate mesh and...
- Patent number 10,490,482
- Issue date Nov 26, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...
- Publication number 20200286849
- Publication date Sep 10, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING POWER ELECTRONIC ASSEMBLIES USING METAL INVERSE...
- Publication number 20200219792
- Publication date Jul 9, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICES INCLUDING JET COOLING WITH AN INTERMEDIATE MESH AND...
- Publication number 20200187392
- Publication date Jun 11, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING CHIP STRUCTURES HAVING A JET IMPINGEMENT SYSTEM AND ASSEMBL...
- Publication number 20200161217
- Publication date May 21, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULES INCLUDING INTEGRATED COOLING
- Publication number 20200152548
- Publication date May 14, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS MODULES INCLUDING INTEGRATED JET COOLING
- Publication number 20200152549
- Publication date May 14, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-HEALING METAL STRUCTURES
- Publication number 20200132400
- Publication date Apr 30, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POWER ELECTRONIC ASSEMBLIES WITH HIGH PURITY ALUMINUM PLATED SUBSTR...
- Publication number 20200135681
- Publication date Apr 30, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLIES HAVING A MESH BOND MATERIAL AND METHODS OF FO...
- Publication number 20200126943
- Publication date Apr 23, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC ASSEMBLIES WITH SOLDER LAYER AND EXTERIOR COATING,...
- Publication number 20200126944
- Publication date Apr 23, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...
- Publication number 20200126946
- Publication date Apr 23, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Cooling chip structures having a jet impingement system and assembl...

Power electronics modules including integrated jet cooling

Power electronic assemblies with solder layer and exterior coating,...

Power electronics modules including an integrated cooling channel e...

Encapsulated stress mitigation layer and power electronic assemblie...

Electronic assemblies having a mesh bond material and methods of fo...

Self-healing metal structures

Methods of forming power electronic assemblies using metal inverse...

Power electronic assemblies with high purity aluminum plated substr...

Cooling devices including jet cooling with an intermediate mesh and...

Encapsulated stress mitigation layer and power electronic assemblie...

Cooling devices having large surface area structures, systems incor...

Encapsulated PCM switching devices and methods of forming the same

Cooling devices including jet cooling with an intermediate mesh and...

Patents Applicationslast 30 patents

ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...

METHODS OF FORMING POWER ELECTRONIC ASSEMBLIES USING METAL INVERSE...

COOLING DEVICES INCLUDING JET COOLING WITH AN INTERMEDIATE MESH AND...

COOLING CHIP STRUCTURES HAVING A JET IMPINGEMENT SYSTEM AND ASSEMBL...

POWER ELECTRONICS MODULES INCLUDING INTEGRATED COOLING

POWER ELECTRONICS MODULES INCLUDING INTEGRATED JET COOLING

SELF-HEALING METAL STRUCTURES

POWER ELECTRONIC ASSEMBLIES WITH HIGH PURITY ALUMINUM PLATED SUBSTR...

ELECTRONIC ASSEMBLIES HAVING A MESH BOND MATERIAL AND METHODS OF FO...

POWER ELECTRONIC ASSEMBLIES WITH SOLDER LAYER AND EXTERIOR COATING,...

ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...