Naoyuki Hosoda

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Composite cards
- Patent number 5,626,937
- Issue date May 6, 1997
- Mitsubishi Materials Corporation
- Masaki Morikawa
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Grant
Composite cards
- Patent number 5,364,482
- Issue date Nov 15, 1994
- Mitsubishi Materials Corporation
- Masaki Morikawa
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Grant
Composite cards
- Patent number 5,120,589
- Issue date Jun 9, 1992
- Mitsubishi Materials Corporation
- Masaki Morikawa
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Grant
Fine gold alloy wire for bonding of a semiconductor device
- Patent number 5,071,619
- Issue date Dec 10, 1991
- Mitsubishi Kinzoku Kabushiki Kaisha
- Naoyuki Hosoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine gold alloy wire for bonding of a semi-conductor device
- Patent number 4,885,135
- Issue date Dec 5, 1989
- Mitsubishi Kinzoku Kabushiki Kaisha
- Naoyuki Hosoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire for bonding a semiconductor device
- Patent number 4,726,859
- Issue date Feb 23, 1988
- Mitsubishi Kinzoku Kabushiki Kaisha
- Naoyuki Hosoda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wire for bonding a semiconductor device
- Patent number 4,717,436
- Issue date Jan 5, 1988
- Mitsubishi Kinzoku Kabushiki Kaisha
- Naoyuki Hosoda
- C30 - CRYSTAL GROWTH
Information Patent Grant
Wire for bonding a semiconductor device and process for producing t...
- Patent number 4,676,827
- Issue date Jun 30, 1987
- Mitsubishi Kinzoku Kabushiki Kaisha
- Naoyuki Hosoda
- C30 - CRYSTAL GROWTH
Information Patent Grant
Process for recovering or purifying selenium
- Patent number 4,663,141
- Issue date May 5, 1987
- Mitsubishi Kinzoku Kabushiki Kaisha
- Noboru Sonoda
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Lead alloy soft solder containing radioactive particles used to mak...
- Patent number 4,512,950
- Issue date Apr 23, 1985
- Mitsubishi Kinzoku Kabushiki Kaisha
- Naoyuki Hosoda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Naoyuki Hosoda

Person

Patents Grantslast 30 patents

Composite cards

Composite cards

Composite cards

Fine gold alloy wire for bonding of a semiconductor device

Fine gold alloy wire for bonding of a semi-conductor device

Wire for bonding a semiconductor device

Wire for bonding a semiconductor device

Wire for bonding a semiconductor device and process for producing t...

Process for recovering or purifying selenium

Lead alloy soft solder containing radioactive particles used to mak...