Naoyuki Koizumi

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrostatic adsorption member and substrate fixing device
- Patent number 11,881,794
- Issue date Jan 23, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroyuki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck and substrate fixing device
- Patent number 11,848,224
- Issue date Dec 19, 2023
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,646,926
- Issue date May 9, 2017
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,412,687
- Issue date Aug 9, 2016
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate having multiple core substrates
- Patent number 9,386,695
- Issue date Jul 5, 2016
- Shinko Electric Industries Co., Ltd.
- Jun Furuichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, method of manufacturing the same, and semiconduct...
- Patent number 9,198,290
- Issue date Nov 24, 2015
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 9,159,648
- Issue date Oct 13, 2015
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,078,384
- Issue date Jul 7, 2015
- Shinko Electric Industries Co., Ltd.
- Jun Furuichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, method of manufacturing the same, and semiconduct...
- Patent number 8,907,489
- Issue date Dec 9, 2014
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric part package and manufacturing method thereof
- Patent number 8,692,363
- Issue date Apr 8, 2014
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, semiconductor device and manufacturing method the...
- Patent number 8,659,127
- Issue date Feb 25, 2014
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and method for manufacturing the same
- Patent number 8,481,863
- Issue date Jul 9, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having an element mounted on a substrate and a...
- Patent number 8,148,738
- Issue date Apr 3, 2012
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same, and sem...
- Patent number 8,120,166
- Issue date Feb 21, 2012
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module substrate including optical transmission mechanism and metho...
- Patent number 8,111,954
- Issue date Feb 7, 2012
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- G02 - OPTICS
Information Patent Grant
Wiring board having efficiently arranged pads
- Patent number 8,053,680
- Issue date Nov 8, 2011
- Shinko Electric Industries Co., Ltd.
- Fumimasa Katagiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting device and method for manufacturing the same
- Patent number 8,044,429
- Issue date Oct 25, 2011
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package for semiconductor device and method of manufacturing the same
- Patent number 7,963,031
- Issue date Jun 21, 2011
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package, semiconductor apparatus, and methods...
- Patent number 7,897,510
- Issue date Mar 1, 2011
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light emitting apparatus and manufacturing method therefor
- Patent number 7,876,036
- Issue date Jan 25, 2011
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and method for manufacturing the same
- Patent number 7,838,897
- Issue date Nov 23, 2010
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Sealed structure and method of fabricating sealed structure and sem...
- Patent number 7,834,438
- Issue date Nov 16, 2010
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 7,825,423
- Issue date Nov 2, 2010
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and semiconductor device
- Patent number 7,786,597
- Issue date Aug 31, 2010
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing light emitting apparatus
- Patent number 7,708,613
- Issue date May 4, 2010
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,705,451
- Issue date Apr 27, 2010
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,655,956
- Issue date Feb 2, 2010
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and manufacturing method thereof
- Patent number 7,622,747
- Issue date Nov 24, 2009
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,605,080
- Issue date Oct 20, 2009
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,494,898
- Issue date Feb 24, 2009
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ELECTROSTATIC ADSORPTION MEMBER AND SUBSTRATE FIXING DEVICE
- Publication number 20220345054
- Publication date Oct 27, 2022
- Shinko Electric Industries Co., Ltd.
- Hiroyuki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE
- Publication number 20220301917
- Publication date Sep 22, 2022
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160276259
- Publication date Sep 22, 2016
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150364405
- Publication date Dec 17, 2015
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCT...
- Publication number 20150048505
- Publication date Feb 19, 2015
- Yuji KUNIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140015121
- Publication date Jan 16, 2014
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20130264101
- Publication date Oct 10, 2013
- Shinko Electric Industries Co., Ltd.
- Jun FURUICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCT...
- Publication number 20130069251
- Publication date Mar 21, 2013
- Shinko Electric Industries Co., Ltd.
- Yuji KUNIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THE...
- Publication number 20120313226
- Publication date Dec 13, 2012
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120234589
- Publication date Sep 20, 2012
- SHINKO ELECTRIC INDUSTRIES., LTD.
- Jun FURUICHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120119391
- Publication date May 17, 2012
- Shinko Electric Industries Co., Ltd.
- Naoyuki KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC PART PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120119379
- Publication date May 17, 2012
- Shinko Electric Industries Co., Ltd.
- Naoyuki KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110032710
- Publication date Feb 10, 2011
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME, AND SEM...
- Publication number 20100052153
- Publication date Mar 4, 2010
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20090266598
- Publication date Oct 29, 2009
- Shinko Electric Industries Co., Ltd.
- Fumimasa Katagiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE SUBSTRATE INCLUDING OPTICAL TRANMISSION MECHANISM AND METHOD...
- Publication number 20090245724
- Publication date Oct 1, 2009
- Shinko Electric Industries Co., Ltd.
- Naoyuki KOIZUMI
- G02 - OPTICS
Information Patent Application
PACKAGE FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090151995
- Publication date Jun 18, 2009
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICOND...
- Publication number 20090145648
- Publication date Jun 11, 2009
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND...
- Publication number 20090145649
- Publication date Jun 11, 2009
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20090146318
- Publication date Jun 11, 2009
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered Circuit Board for Connection to Bumps
- Publication number 20090133917
- Publication date May 28, 2009
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080251287
- Publication date Oct 16, 2008
- Shinko Electric Industries Co., Ltd.
- Akinori SHIRAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080150162
- Publication date Jun 26, 2008
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20080150109
- Publication date Jun 26, 2008
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package, semiconductor apparatus, and methods...
- Publication number 20080054486
- Publication date Mar 6, 2008
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080029852
- Publication date Feb 7, 2008
- Kei Murayama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20070290329
- Publication date Dec 20, 2007
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component device
- Publication number 20070241451
- Publication date Oct 18, 2007
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20070194712
- Publication date Aug 23, 2007
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20070187706
- Publication date Aug 16, 2007
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS

Naoyuki Koizumi

Person

Patents Grantslast 30 patents

Electrostatic adsorption member and substrate fixing device

Electrostatic chuck and substrate fixing device

Wiring substrate and method of manufacturing the same

Wiring substrate and method of manufacturing the same

Wiring substrate having multiple core substrates

Wiring substrate, method of manufacturing the same, and semiconduct...

Wiring substrate and manufacturing method thereof

Wiring substrate and method of manufacturing the same

Wiring substrate, method of manufacturing the same, and semiconduct...

Electric part package and manufacturing method thereof

Wiring substrate, semiconductor device and manufacturing method the...

Substrate and method for manufacturing the same

Semiconductor device having an element mounted on a substrate and a...

Semiconductor package and method of manufacturing the same, and sem...

Module substrate including optical transmission mechanism and metho...

Wiring board having efficiently arranged pads

Light-emitting device and method for manufacturing the same

Package for semiconductor device and method of manufacturing the same

Semiconductor device package, semiconductor apparatus, and methods...

Light emitting apparatus and manufacturing method therefor

Light-emitting device and method for manufacturing the same

Sealed structure and method of fabricating sealed structure and sem...

Semiconductor device and method of manufacturing semiconductor device

Multilayer wiring board and semiconductor device

Method of producing light emitting apparatus

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Light emitting device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Method for manufacturing semiconductor device

Patents Applicationslast 30 patents

ELECTROSTATIC ADSORPTION MEMBER AND SUBSTRATE FIXING DEVICE

ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCT...

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCT...

WIRING SUBSTRATE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THE...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRIC PART PACKAGE AND MANUFACTURING METHOD THEREOF

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME, AND SEM...

WIRING BOARD

MODULE SUBSTRATE INCLUDING OPTICAL TRANMISSION MECHANISM AND METHOD...

PACKAGE FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICOND...

MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND...

MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE

Multilayered Circuit Board for Connection to Bumps

SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT

Semiconductor device package, semiconductor apparatus, and methods...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing semiconductor device

Electronic component device

Semiconductor device and method of manufacturing semiconductor device

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME