Naoyuki Komuta

Person

Oita-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method
- Patent number 10,903,200
- Issue date Jan 26, 2021
- TOSHIBA MEMORY CORPORATION
- Yuji Karakane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,854,576
- Issue date Dec 1, 2020
- TOSHIBA MEMORY CORPORATION
- Yuji Karakane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 10,600,773
- Issue date Mar 24, 2020
- TOSHIBA MEMORY CORPORATION
- Yuji Karakane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing a semiconductor device inclu...
- Patent number 10,217,676
- Issue date Feb 26, 2019
- TOSHIBA MEMORY CORPORATION
- Shinya Fukayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 10,090,273
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Naoyuki Komuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic component and manufacturing app...
- Patent number 9,960,143
- Issue date May 1, 2018
- TOSHIBA MEMORY CORPORATION
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 9,449,949
- Issue date Sep 20, 2016
- Kabushiki Kaisha Toshiba
- Naoyuki Komuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,224,713
- Issue date Dec 29, 2015
- Kabushiki Kaisha Toshiba
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection apparatus and inspection method for semiconductor device
- Patent number 9,052,187
- Issue date Jun 9, 2015
- Kabushiki Kaisha Toshiba
- Naoyuki Komuta
- G01 - MEASURING TESTING
Information Patent Grant
Stacked electronic component and manufacturing method thereof
- Patent number 9,024,424
- Issue date May 5, 2015
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,710,654
- Issue date Apr 29, 2014
- Kabushiki Kaisha Toshiba
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic component and manufacturing method thereof
- Patent number 8,268,673
- Issue date Sep 18, 2012
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 8,191,758
- Issue date Jun 5, 2012
- Kabushiki Kaisha Toshiba
- Kanako Sawada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked electronic component and manufacturing method thereof
- Patent number 8,008,763
- Issue date Aug 30, 2011
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic component and manufacturing method thereof
- Patent number 7,629,695
- Issue date Dec 8, 2009
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20200185373
- Publication date Jun 11, 2020
- Toshiba Memory Corporation
- Yuji KARAKANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180261574
- Publication date Sep 13, 2018
- Toshiba Memory Corporation
- Yuji KARAKANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20180076187
- Publication date Mar 15, 2018
- Toshiba Memory Corporation
- Yuji KARAKANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND MANUFACTURING APP...
- Publication number 20170263585
- Publication date Sep 14, 2017
- Kabushiki Kaisha Toshiba
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE INCLU...
- Publication number 20170069551
- Publication date Mar 9, 2017
- Kabushiki Kaisha Toshiba
- Shinya FUKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160079200
- Publication date Mar 17, 2016
- Kabushiki Kaisha Toshiba
- Naoyuki KOMUTA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20150262847
- Publication date Sep 17, 2015
- Kabushiki Kaisha Toshiba
- Naoyuki KOMUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20150214193
- Publication date Jul 30, 2015
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140206144
- Publication date Jul 24, 2014
- KABUSHIKI KAISHA TOSHIBA
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION APPARATUS AND INSPECTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20130250298
- Publication date Sep 26, 2013
- Kabushiki Kaisha Toshiba
- Naoyuki KOMUTA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130134583
- Publication date May 30, 2013
- Kabushiki Kaisha Toshiba
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20120306103
- Publication date Dec 6, 2012
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked electronic component and manufacturing method thereof
- Publication number 20110281396
- Publication date Nov 17, 2011
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100320258
- Publication date Dec 23, 2010
- Kabushiki Kaisha Toshiba
- Kanako Sawada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked electronic component and manufacturing method thereof
- Publication number 20080197470
- Publication date Aug 21, 2008
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked electronic component and manufacturing method thereof
- Publication number 20060139893
- Publication date Jun 29, 2006
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS

Naoyuki Komuta

Person

Patents Grantslast 30 patents

Semiconductor device manufacturing method

Semiconductor device and manufacturing method thereof

Semiconductor device manufacturing method

Method and apparatus for manufacturing a semiconductor device inclu...

Apparatus and method for manufacturing semiconductor device

Method for manufacturing electronic component and manufacturing app...

Method for manufacturing semiconductor device and semiconductor device

Semiconductor device and manufacturing method thereof

Inspection apparatus and inspection method for semiconductor device

Stacked electronic component and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Stacked electronic component and manufacturing method thereof

Method for manufacturing semiconductor device

Stacked electronic component and manufacturing method thereof

Stacked electronic component and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND MANUFACTURING APP...

METHOD AND APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE INCLU...

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

STACKED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INSPECTION APPARATUS AND INSPECTION METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STACKED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Stacked electronic component and manufacturing method thereof

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Stacked electronic component and manufacturing method thereof

Stacked electronic component and manufacturing method thereof