Naoyuki Shino

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Kokubu, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layered wiring board for slot coupling a transmission line to...
- Patent number 6,870,438
- Issue date Mar 22, 2005
- Kyocera Corporation
- Naoyuki Shino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency package, wiring board, and high frequency module hav...
- Patent number 6,642,808
- Issue date Nov 4, 2003
- Kyocera Corporation
- Shinichi Koriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency module coupled via aperture in a ground plane
- Patent number 6,356,173
- Issue date Mar 12, 2002
- Kyocera Corporation
- Koichi Nagata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High frequency package, wiring board, and high frequency module
- Publication number 20020003298
- Publication date Jan 10, 2002
- Shinichi Koriyama
- H01 - BASIC ELECTRIC ELEMENTS