Nathan Ip

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and process using fingerprint based semiconductor manufactur...
- Patent number 11,868,119
- Issue date Jan 9, 2024
- Tokyo Electron Limited
- Nathan Ip
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer bonding apparatus and methods to reduce post-bond wafer disto...
- Patent number 11,594,431
- Issue date Feb 28, 2023
- Tokyo Electron Limited
- Nathan Ip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 11,574,808
- Issue date Feb 7, 2023
- Tokyo Electron Limited
- Satoshi Itoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Enhancement of yield of functional microelectronic devices
- Patent number 11,435,393
- Issue date Sep 6, 2022
- Tokyo Electron Limited
- Carlos A. Fonseca
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Enhancement of yield of functional microelectronic devices
- Patent number 11,346,882
- Issue date May 31, 2022
- Tokyo Electron Limited
- Carlos A. Fonseca
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and methods for wafer to wafer bonding
- Patent number 11,335,607
- Issue date May 17, 2022
- Tokyo Electron Limited
- Nathan Ip
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for manufacturing microelectronic devices
- Patent number 11,244,873
- Issue date Feb 8, 2022
- Tokyo Electron Limited
- Carlos A. Fonseca
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Amelioration of global wafer distortion based on determination of l...
- Patent number 10,622,233
- Issue date Apr 14, 2020
- Tokyo Electron Limited
- Joshua Hooge
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED METROLOGY FOR PROCESS CONTROLS IN WAFER BONDING SYSTEM
- Publication number 20250029847
- Publication date Jan 23, 2025
- TOKYO ELECTRON LIMITED
- Nathan IP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT CHUCK EDGE RING
- Publication number 20240250059
- Publication date Jul 25, 2024
- TOKYO ELECTRON LIMITED
- Christopher NETZBAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING PROCESS WITH REDUCED OVERLAY DISTORTION
- Publication number 20240063022
- Publication date Feb 22, 2024
- TOKYO ELECTRON LIMITED
- Christopher Michael Netzband
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK WITH TUNABLE STIFFNESS MATERIAL
- Publication number 20230234188
- Publication date Jul 27, 2023
- TOKYO ELECTRON LIMITED
- Nathan Ip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And Process Using Fingerprint Based Semiconductor Manufactur...
- Publication number 20230102438
- Publication date Mar 30, 2023
- TOKYO ELECTRON LIMITED
- Nathan Ip
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER BONDING APPARATUS AND METHODS TO REDUCE POST-BOND WAFER DISTO...
- Publication number 20220344179
- Publication date Oct 27, 2022
- TOKYO ELECTRON LIMITED
- Nathan Ip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20220262631
- Publication date Aug 18, 2022
- TOKYO ELECTRON LIMITED
- Satoshi ITOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Methods for Wafer to Wafer Bonding
- Publication number 20220013416
- Publication date Jan 13, 2022
- TOKYO ELECTRON LIMITED
- Nathan Ip
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Systems and Methods For Manufacturing Microelectronic Devices
- Publication number 20200135592
- Publication date Apr 30, 2020
- TOKYO ELECTRON LIMITED
- Carlos A. Fonseca
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENHANCEMENT OF YIELD OF FUNCTIONAL MICROELECTRONIC DEVICES
- Publication number 20190137565
- Publication date May 9, 2019
- TOKYO ELECTRON LIMITED
- Carlos A. Fonseca
- G01 - MEASURING TESTING
Information Patent Application
ENHANCEMENT OF YIELD OF FUNCTIONAL MICROELECTRONIC DEVICES
- Publication number 20190139798
- Publication date May 9, 2019
- TOKYO ELECTRON LIMITED
- Carlos A. Fonseca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMELIORATION OF GLOBAL WAFER DISTORTION BASED ON DETERMINATION OF L...
- Publication number 20180342410
- Publication date Nov 29, 2018
- TOKYO ELECTRON LIMITED
- Joshua Hooge
- G06 - COMPUTING CALCULATING COUNTING

Person

Patents Grantslast 30 patents

Method and process using fingerprint based semiconductor manufactur...

Wafer bonding apparatus and methods to reduce post-bond wafer disto...

Plasma processing method and plasma processing apparatus

Enhancement of yield of functional microelectronic devices

Enhancement of yield of functional microelectronic devices

Apparatus and methods for wafer to wafer bonding

Systems and methods for manufacturing microelectronic devices

Amelioration of global wafer distortion based on determination of l...

Patents Applicationslast 30 patents

INTEGRATED METROLOGY FOR PROCESS CONTROLS IN WAFER BONDING SYSTEM

COMPLIANT CHUCK EDGE RING

WAFER BONDING PROCESS WITH REDUCED OVERLAY DISTORTION

WAFER CHUCK WITH TUNABLE STIFFNESS MATERIAL

Method And Process Using Fingerprint Based Semiconductor Manufactur...

WAFER BONDING APPARATUS AND METHODS TO REDUCE POST-BOND WAFER DISTO...

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

Apparatus and Methods for Wafer to Wafer Bonding

Systems and Methods For Manufacturing Microelectronic Devices

ENHANCEMENT OF YIELD OF FUNCTIONAL MICROELECTRONIC DEVICES

ENHANCEMENT OF YIELD OF FUNCTIONAL MICROELECTRONIC DEVICES

AMELIORATION OF GLOBAL WAFER DISTORTION BASED ON DETERMINATION OF L...