Nathapong SUTHIWONGSUNTHORN

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods for forming semiconductor package
- Patent number 10,381,280
- Issue date Aug 13, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 10,354,934
- Issue date Jul 16, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,978,658
- Issue date May 22, 2018
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,881,863
- Issue date Jan 30, 2018
- UTAC HEADQUARTERS PTE. LTD.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a thin wafer without a c...
- Patent number 9,842,775
- Issue date Dec 12, 2017
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for singulating semiconductor wafer
- Patent number 9,741,619
- Issue date Aug 22, 2017
- UTAC HEADQUARTERS PTE. LTD.
- William John Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming semiconductor package
- Patent number 9,613,877
- Issue date Apr 4, 2017
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,589,875
- Issue date Mar 7, 2017
- UTAC HEADQUARTERS PTE. LTD.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a shielding layer betwee...
- Patent number 9,583,446
- Issue date Feb 28, 2017
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for singulating semiconductor wafer
- Patent number 9,570,314
- Issue date Feb 14, 2017
- UTAC HEADQUARTERS PTE. LTD.
- William John Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,508,623
- Issue date Nov 29, 2016
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe area array packaging technology
- Patent number 9,472,532
- Issue date Oct 18, 2016
- UTAC HEADQUARTERS PTE. LTD.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a thin wafer without a c...
- Patent number 9,443,762
- Issue date Sep 13, 2016
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die and method of forming noise absorbing regions bet...
- Patent number 9,236,352
- Issue date Jan 12, 2016
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,136,142
- Issue date Sep 15, 2015
- United Test & Assembly Center Ltd.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making TSV interconnect structur...
- Patent number 9,054,083
- Issue date Jun 9, 2015
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an interconnect structur...
- Patent number 9,029,193
- Issue date May 12, 2015
- STATS ChipPAC, Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe area array packaging technology
- Patent number 9,023,690
- Issue date May 5, 2015
- United Test and Assembly Center
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a shielding layer betwee...
- Patent number 8,907,498
- Issue date Dec 9, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 8,860,079
- Issue date Oct 14, 2014
- United Test & Assembly Center Ltd.
- Catherine Bee Liang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 8,829,666
- Issue date Sep 9, 2014
- United Test & Assembly Center Ltd.
- Catherine Bee Liang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 8,716,873
- Issue date May 6, 2014
- United Test & Assembly Center Ltd.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive TSV with insu...
- Patent number 8,703,610
- Issue date Apr 22, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an interconnect structure with TSV usin...
- Patent number 8,659,162
- Issue date Feb 25, 2014
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a thin wafer without a c...
- Patent number 8,531,015
- Issue date Sep 10, 2013
- STATS ChipPAC, Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a shielding layer betwee...
- Patent number 8,378,383
- Issue date Feb 19, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive TSV with insu...
- Patent number 8,349,735
- Issue date Jan 8, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an interposer package wi...
- Patent number 8,263,439
- Issue date Sep 11, 2012
- STATS ChipPAC, Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer integrated with permanent carrier and method therefor
- Patent number 8,125,073
- Issue date Feb 28, 2012
- STATS ChipPAC, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die and method of forming noise absorbing regions bet...
- Patent number 8,093,151
- Issue date Jan 10, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20180240726
- Publication date Aug 23, 2018
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE
- Publication number 20170294401
- Publication date Oct 12, 2017
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20170148722
- Publication date May 25, 2017
- UTAC Headquarters Pte. Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SINGULATING SEMICONDUCTOR WAFER
- Publication number 20170117185
- Publication date Apr 27, 2017
- UTAC Headquarters Pte. Ltd.
- William John NELSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20170077007
- Publication date Mar 16, 2017
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Thin Wafer Without a C...
- Publication number 20160336230
- Publication date Nov 17, 2016
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SINGULATING SEMICONDUCTOR WAFER
- Publication number 20160104626
- Publication date Apr 14, 2016
- UTAC Headquarters Pte. Ltd.
- William John NELSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20150380346
- Publication date Dec 31, 2015
- UTAC Headquarters Pte. Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20150357256
- Publication date Dec 10, 2015
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY
- Publication number 20150214187
- Publication date Jul 30, 2015
- United Test and Assembly Center, Ltd.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Shielding Layer Betwee...
- Publication number 20150115394
- Publication date Apr 30, 2015
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE
- Publication number 20150102478
- Publication date Apr 16, 2015
- United Test & Assembly Center Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140227832
- Publication date Aug 14, 2014
- United Test & Assembly Center Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY
- Publication number 20140138808
- Publication date May 22, 2014
- United Test & Assembly Center Ltd.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having an Interconnect Structure with TSV Usin...
- Publication number 20140110861
- Publication date Apr 24, 2014
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Thin Wafer Without a C...
- Publication number 20130285236
- Publication date Oct 31, 2013
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive TSV With Insu...
- Publication number 20130087928
- Publication date Apr 11, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Shielding Layer Betwee...
- Publication number 20130087897
- Publication date Apr 11, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20120220082
- Publication date Aug 30, 2012
- United Test and Assembly Center, Ltd.
- Catherine Bee Liang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20120119378
- Publication date May 17, 2012
- United Test & Assembly Center Ltd.
- Catherine Bee Liang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die and Method of Forming Noise Absorbing Regions Bet...
- Publication number 20120091567
- Publication date Apr 19, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of forming conductive TSV with insu...
- Publication number 20120068313
- Publication date Mar 22, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having an Interconnect Structure with TSV Usin...
- Publication number 20120013004
- Publication date Jan 19, 2012
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20120001306
- Publication date Jan 5, 2012
- United Test & Assembly Center Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Integrated With Permanent Carrier and Method Therefor
- Publication number 20110101509
- Publication date May 5, 2011
- STATS ChipPAC, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Interposer Package wi...
- Publication number 20110024916
- Publication date Feb 3, 2011
- STATS ChipPAC, Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Interconnect Structur...
- Publication number 20100308443
- Publication date Dec 9, 2010
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Shielding Layer Betwee...
- Publication number 20100244208
- Publication date Sep 30, 2010
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Thin Wafer Without a C...
- Publication number 20100244241
- Publication date Sep 30, 2010
- STATS ChipPAC, Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die and Method of Forming Noise Absorbing Regions Bet...
- Publication number 20100230822
- Publication date Sep 16, 2010
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS

Nathapong SUTHIWONGSUNTHORN

Person

Patents Grantslast 30 patents

Semiconductor packages and methods for forming semiconductor package

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device and method of forming a thin wafer without a c...

Methods for singulating semiconductor wafer

Semiconductor packages and methods for forming semiconductor package

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device and method of forming a shielding layer betwee...

Methods for singulating semiconductor wafer

Semiconductor packages and methods of packaging semiconductor devices

Leadframe area array packaging technology

Semiconductor device and method of forming a thin wafer without a c...

Semiconductor die and method of forming noise absorbing regions bet...

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device and method of making TSV interconnect structur...

Semiconductor device and method of forming an interconnect structur...

Leadframe area array packaging technology

Semiconductor device and method of forming a shielding layer betwee...

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device and method of forming conductive TSV with insu...

Semiconductor device having an interconnect structure with TSV usin...

Semiconductor device and method of forming a thin wafer without a c...

Semiconductor device and method of forming a shielding layer betwee...

Semiconductor device and method of forming conductive TSV with insu...

Semiconductor device and method of forming an interposer package wi...

Wafer integrated with permanent carrier and method therefor

Semiconductor die and method of forming noise absorbing regions bet...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

METHODS FOR SINGULATING SEMICONDUCTOR WAFER

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Semiconductor Device and Method of Forming a Thin Wafer Without a C...

METHODS FOR SINGULATING SEMICONDUCTOR WAFER

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY

Semiconductor Device and Method of Forming a Shielding Layer Betwee...

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY

Semiconductor Device Having an Interconnect Structure with TSV Usin...

Semiconductor Device and Method of Forming a Thin Wafer Without a C...

Semiconductor Device and Method of Forming Conductive TSV With Insu...

Semiconductor Device and Method of Forming a Shielding Layer Betwee...

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Semiconductor Die and Method of Forming Noise Absorbing Regions Bet...

Semiconductor device and method of forming conductive TSV with insu...

Semiconductor Device Having an Interconnect Structure with TSV Usin...

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Wafer Integrated With Permanent Carrier and Method Therefor

Semiconductor Device and Method of Forming an Interposer Package wi...

Semiconductor Device and Method of Forming an Interconnect Structur...

Semiconductor Device and Method of Forming a Shielding Layer Betwee...

Semiconductor Device and Method of Forming a Thin Wafer Without a C...

Semiconductor Die and Method of Forming Noise Absorbing Regions Bet...