Nathapop Lappanitpullpol

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Pathumthanee, TH

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Patents Grantslast 30 patents

Information Patent Grant
Method for glob top encapsulation using molding tape with elevated...
- Patent number 11,637,024
- Issue date Apr 25, 2023
- NXP B.V.
- Wiwat Tanwongwan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Glob top encapsulation using molding tape
- Patent number 10,847,385
- Issue date Nov 24, 2020
- NXP B.V.
- Wiwat Tanwongwan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive trace design for smart card
- Patent number 10,763,203
- Issue date Sep 1, 2020
- NXP B.V.
- Amornthep Saiyajitara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GLOB TOP ENCAPSULATION USING MOLDING TAPE
- Publication number 20210035820
- Publication date Feb 4, 2021
- NXP B.V.
- Wiwat Tanwongwan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE TRACE DESIGN FOR SMART CARD
- Publication number 20200258831
- Publication date Aug 13, 2020
- NXP B.V.
- Amornthep Saiyajitara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLOB TOP ENCAPSULATION USING MOLDING TAPE
- Publication number 20200111685
- Publication date Apr 9, 2020
- NXP B.V.
- Wiwat Tanwongwan
- G06 - COMPUTING CALCULATING COUNTING