Natsuki Makino

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 11,426,834
- Issue date Aug 30, 2022
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 10,486,285
- Issue date Nov 26, 2019
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 9,687,957
- Issue date Jun 27, 2017
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 9,358,662
- Issue date Jun 7, 2016
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 8,795,032
- Issue date Aug 5, 2014
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Circuit board, semiconductor device, process for manufacturing circ...
- Patent number 8,742,568
- Issue date Jun 3, 2014
- Sumitomo Bakelite Company, Ltd.
- Masayoshi Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hand having rocking mechanism and substrate delivering device havin...
- Patent number 8,038,136
- Issue date Oct 18, 2011
- Kabushiki Kaisha Yaskawa Denki
- Hiroki Sanemasa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plating apparatus
- Patent number 7,901,550
- Issue date Mar 8, 2011
- Ebara Corporation
- Natsuki Makino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic processing apparatus and method
- Patent number 7,442,282
- Issue date Oct 28, 2008
- Ebara Corporation
- Natsuki Makino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of performing electrolytic treatment on a conductive layer o...
- Patent number 7,387,717
- Issue date Jun 17, 2008
- Ebara Corporation
- Junji Kunisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic processing apparatus and substrate processing method
- Patent number 7,374,646
- Issue date May 20, 2008
- Ebara Corporation
- Hidenao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate plating apparatus
- Patent number 7,208,074
- Issue date Apr 24, 2007
- Ebara Corporation
- Koji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 6,767,437
- Issue date Jul 27, 2004
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plating method and plating apparatus
- Patent number 6,746,589
- Issue date Jun 8, 2004
- Ebara Corporation
- Koji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate plating apparatus
- Patent number 6,689,257
- Issue date Feb 10, 2004
- Ebara Corporation
- Koji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus
- Patent number 6,632,335
- Issue date Oct 14, 2003
- Ebara Corporation
- Junji Kunisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...
- Publication number 20200047309
- Publication date Feb 13, 2020
- Mitsuru MIYAZAKI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...
- Publication number 20170252894
- Publication date Sep 7, 2017
- EBARA CORPORATION
- Mitsuru Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...
- Publication number 20150050863
- Publication date Feb 19, 2015
- EBARA CORPORATION
- Mitsuru MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...
- Publication number 20140302676
- Publication date Oct 9, 2014
- Mitsuru MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, PROCESS FOR MANUFACTURING CIRC...
- Publication number 20130015582
- Publication date Jan 17, 2013
- SUMITOMO BAKELITE CO., LTD.
- Masayoshi Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate processing apparatus, substrate processing method, substr...
- Publication number 20090305612
- Publication date Dec 10, 2009
- EBARA CORPORATION
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Application
HAND HAVING ROCKING MECHANISM AND SUBSTRATE DELIVERING DEVICE HAVIN...
- Publication number 20090236786
- Publication date Sep 24, 2009
- KABUSHIKI KAISHA YASKAWA DENKI
- Hiroki SANEMASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plating method
- Publication number 20090095634
- Publication date Apr 16, 2009
- Natsuki Makino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus
- Publication number 20090095618
- Publication date Apr 16, 2009
- Natsuki Makino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20080296165
- Publication date Dec 4, 2008
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20080251385
- Publication date Oct 16, 2008
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cleaning method and cleaning apparatus for porous member
- Publication number 20080035171
- Publication date Feb 14, 2008
- Hiroyuki Kanda
- B08 - CLEANING
Information Patent Application
Electrolytic processing apparatus and method
- Publication number 20070034526
- Publication date Feb 15, 2007
- Natsuki Makino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate processing apparatus and substrate plating apparatus
- Publication number 20060027452
- Publication date Feb 9, 2006
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic processing apparatus and method
- Publication number 20050155865
- Publication date Jul 21, 2005
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus, plating method and substrate processing apparatus
- Publication number 20050023149
- Publication date Feb 3, 2005
- Tsutomu Nakada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic processing apparatus and substrate processing method
- Publication number 20040256238
- Publication date Dec 23, 2004
- Hidenao Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method and plating apparatus
- Publication number 20040195106
- Publication date Oct 7, 2004
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing apparatus and substrate plating apparatus
- Publication number 20040134789
- Publication date Jul 15, 2004
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic processing apparatus and method
- Publication number 20040129576
- Publication date Jul 8, 2004
- Natsuki Makino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus
- Publication number 20040069646
- Publication date Apr 15, 2004
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method and plating apparatus
- Publication number 20020056647
- Publication date May 16, 2002
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method for substrate
- Publication number 20020033339
- Publication date Mar 21, 2002
- Norio Kimura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method for substrate
- Publication number 20020020627
- Publication date Feb 21, 2002
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing apparatus and substrate plating apparatus
- Publication number 20020000371
- Publication date Jan 3, 2002
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating apparatus and electroplating method
- Publication number 20020000379
- Publication date Jan 3, 2002
- Tetsuo Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor substrate processing apparatus and method
- Publication number 20010024691
- Publication date Sep 27, 2001
- Norio Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Natsuki Makino

Person

Patents Grantslast 30 patents

Substrate processing apparatus, substrate processing method, substr...

Substrate processing apparatus, substrate processing method, substr...

Substrate processing apparatus, substrate processing method, substr...

Substrate processing apparatus, substrate processing method, substr...

Substrate processing apparatus, substrate processing method, substr...

Circuit board, semiconductor device, process for manufacturing circ...

Hand having rocking mechanism and substrate delivering device havin...

Plating apparatus

Electrolytic processing apparatus and method

Method of performing electrolytic treatment on a conductive layer o...

Electrolytic processing apparatus and substrate processing method

Substrate processing apparatus and substrate plating apparatus

Electroplating apparatus and electroplating method

Plating method and plating apparatus

Substrate processing apparatus and substrate plating apparatus

Plating apparatus

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, PROCESS FOR MANUFACTURING CIRC...

Substrate processing apparatus, substrate processing method, substr...

HAND HAVING ROCKING MECHANISM AND SUBSTRATE DELIVERING DEVICE HAVIN...

Plating method

Plating apparatus

PLATING APPARATUS

PLATING APPARATUS

Cleaning method and cleaning apparatus for porous member

Electrolytic processing apparatus and method

Substrate processing apparatus and substrate plating apparatus

Electrolytic processing apparatus and method

Plating apparatus, plating method and substrate processing apparatus

Electrolytic processing apparatus and substrate processing method

Plating method and plating apparatus

Substrate processing apparatus and substrate plating apparatus

Electrolytic processing apparatus and method

Plating apparatus

Plating method and plating apparatus

Plating apparatus and plating method for substrate

Plating apparatus and plating method for substrate

Substrate processing apparatus and substrate plating apparatus

Electroplating apparatus and electroplating method

Semiconductor substrate processing apparatus and method