Navaneetha Krishnan Subbaiyan

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Hermetic fully-filled metallized through-hole vias
- Patent number 11,171,094
- Issue date Nov 9, 2021
- Corning Incorporated
- Prantik Mazumder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming capped metallized vias
- Patent number 11,158,519
- Issue date Oct 26, 2021
- Corning Incorporated
- Navaneetha Krishnan Subbaiyan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HERMETIC FULLY-FILLED METALLIZED THROUGH-HOLE VIAS
- Publication number 20200251424
- Publication date Aug 6, 2020
- Corning Incorporated
- Prantik Mazumder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CAPPED METALLIZED VIAS
- Publication number 20200185272
- Publication date Jun 11, 2020
- Corning Incorporated
- Navaneetha Krishnan Subbaiyan
- H01 - BASIC ELECTRIC ELEMENTS