Navas O.K. Khan

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Enhanced chip scale package for wire bond dies
- Patent number 6,710,438
- Issue date Mar 23, 2004
- Institute of Microelectronics
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Enhanced chip scale package for wire bond dies
- Publication number 20030155641
- Publication date Aug 21, 2003
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS