Naveen Kini

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with dual second level electrical interconnec...
- Patent number 10,028,380
- Issue date Jul 17, 2018
- SanDisk Technologies LLC
- Abhishek Ramesh Tambat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component including micro balls
- Patent number 8,637,779
- Issue date Jan 28, 2014
- SanDisk Technologies Inc.
- Suresh Upadhyayula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH DUAL SECOND LEVEL ELECTRICAL INTERCONNEC...
- Publication number 20160120031
- Publication date Apr 28, 2016
- SANDISK TECHNOLOGIES INC.
- Abhishek Ramesh Tambat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT INCLUDING MICRO BALLS
- Publication number 20120305305
- Publication date Dec 6, 2012
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS FOR MITIGATING PAD DELAMINATION
- Publication number 20120281377
- Publication date Nov 8, 2012
- Naveen Kini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR