Navid Kazem

Person

Pittsburgh, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface material, an integrated circuit formed therewith,...
- Patent number 12,027,442
- Issue date Jul 2, 2024
- ARIECA INC.
- Jeffrey Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of synthesizing a thermally conductive and stretchable polym...
- Patent number 11,732,172
- Issue date Aug 22, 2023
- Carnegie Mellon University
- Navid Kazem
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method, apparatus, and assembly for thermally connecting layers
- Patent number 11,335,622
- Issue date May 17, 2022
- ARIECA INC.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer composite with liquid phase metal inclusions
- Patent number 11,232,883
- Issue date Jan 25, 2022
- Carnegie Mellon University, a Pennsylvania Non-Profit Corporation
- Carmel Majidi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, apparatus, and assembly for thermally connecting layers
- Patent number 10,777,483
- Issue date Sep 15, 2020
- ARIECA INC.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer composite with liquid phase metal inclusions
- Patent number 10,720,261
- Issue date Jul 21, 2020
- Carnegie Mellon University, a Pennsylvania Non-Profit Corporation
- Carmel Majidi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL IN...
- Publication number 20240243033
- Publication date Jul 18, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS W...
- Publication number 20240213115
- Publication date Jun 27, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS
- Publication number 20210272873
- Publication date Sep 2, 2021
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SYNTHESIZING A THERMALLY CONDUCTIVE AND STRETCHABLE POLYM...
- Publication number 20200362218
- Publication date Nov 19, 2020
- Carnegie Mellon University
- Navid KAZEM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Composite with Liquid Phase Metal Inclusions
- Publication number 20200328007
- Publication date Oct 15, 2020
- CARNEGIE MELLON UNIVERSITY, a Pennsylvania Non-Profit Corporation
- Carmel Majidi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Composite with Liquid Phase Metal Inclusions
- Publication number 20170218167
- Publication date Aug 3, 2017
- CARNEGIE MELLON UNIVERSITY, a Pennsylvania Non-Profit Corporation
- Carmel Majidi
- H01 - BASIC ELECTRIC ELEMENTS

Navid Kazem

Person

Patents Grantslast 30 patents

Thermal interface material, an integrated circuit formed therewith,...

Method of synthesizing a thermally conductive and stretchable polym...

Method, apparatus, and assembly for thermally connecting layers

Polymer composite with liquid phase metal inclusions

Method, apparatus, and assembly for thermally connecting layers

Polymer composite with liquid phase metal inclusions

Patents Applicationslast 30 patents

METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL IN...

A METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS W...

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS

METHOD OF SYNTHESIZING A THERMALLY CONDUCTIVE AND STRETCHABLE POLYM...

Polymer Composite with Liquid Phase Metal Inclusions

Polymer Composite with Liquid Phase Metal Inclusions