Nayandeep K. Mahanta

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip packages and sinterable paste for use with thermal inter...
- Patent number 11,404,349
- Issue date Aug 2, 2022
- Intel Corporation
- Nachiket R. Raravikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package that includes finned vias
- Patent number 9,795,026
- Issue date Oct 17, 2017
- Intel Corporation
- Nayandeep K. Mahanta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGES AND SINTERABLE PASTE FOR USE WITH THERMAL INTER...
- Publication number 20190267306
- Publication date Aug 29, 2019
- Intel Corporation
- Nachiket R. RARAVIKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE THAT INCLUDES FINNED VIAS
- Publication number 20170171957
- Publication date Jun 15, 2017
- Intel Corporation
- Nayandeep K. Mahanta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR