Nazir Ahmad

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical connectors of building integrable photovoltaic modules
- Patent number 9,935,225
- Issue date Apr 3, 2018
- Beijing Apollo Ding Rong Solar Technology Co., Ltd.
- Jason S. Corneille
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and method of forming a metallurgical intercon...
- Patent number 9,312,150
- Issue date Apr 12, 2016
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connectors of building integrable photovoltaic modules
- Patent number 9,112,080
- Issue date Aug 18, 2015
- Apollo Precision (Kunming) Yuanhong Limited
- Jason S. Corneille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnecting a chip and a substrate by bonding pure metal bumps...
- Patent number 8,119,450
- Issue date Feb 21, 2012
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-coplanarity bumping shape for flip-chip
- Patent number 7,407,877
- Issue date Aug 5, 2008
- ChipPAC, Inc.
- Young-Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-coplanarity bumping shape for flip chip
- Patent number 7,211,901
- Issue date May 1, 2007
- ChipPAC, Inc.
- Young-Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-coplanarity bumping shape for flip chip
- Patent number 6,940,178
- Issue date Sep 6, 2005
- ChipPAC, Inc.
- Young-Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package with flip chip interconnect
- Patent number 6,737,295
- Issue date May 18, 2004
- ChipPAC, Inc.
- Rajendra Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making energy storage device having electrodes coated wit...
- Patent number 6,514,296
- Issue date Feb 4, 2003
- Pacific ShinFu Technologies Co., Ltd.
- K. C. Tsai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Energy storage device
- Patent number 5,867,363
- Issue date Feb 2, 1999
- Pinnacle Research Institute, Inc.
- K. C. Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy storage device and methods of manufacture
- Patent number 5,800,857
- Issue date Sep 1, 1998
- Pinnacle Research Institute, Inc.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTORS OF BUILDING INTEGRABLE PHOTOVOLTAIC MODULES
- Publication number 20160027944
- Publication date Jan 28, 2016
- APOLLO PRECISION (KUNMING) YUANHONG LIMITED
- Jason S. Corneille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL TERMINATIONS FOR FLEXIBLE PHOTOVOLTAIC MODULES
- Publication number 20140261635
- Publication date Sep 18, 2014
- NANOSOLAR, INC.
- Eric Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Metallurgical Intercon...
- Publication number 20130113093
- Publication date May 9, 2013
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure and Method
- Publication number 20120217635
- Publication date Aug 30, 2012
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Metallurgical Intercon...
- Publication number 20120049357
- Publication date Mar 1, 2012
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure and Method
- Publication number 20120013005
- Publication date Jan 19, 2012
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure and Method
- Publication number 20090227072
- Publication date Sep 10, 2009
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure and method
- Publication number 20060255474
- Publication date Nov 16, 2006
- ChipPAC, Inc.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-coplanarity bumping shape for flip chip
- Publication number 20050218515
- Publication date Oct 6, 2005
- ChipPAC, Inc.
- Young-Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making self-coplanarity bumping shape for flip chip
- Publication number 20050221535
- Publication date Oct 6, 2005
- ChipPAC, Inc.
- Young-Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale package with flip chip interconnect
- Publication number 20040222440
- Publication date Nov 11, 2004
- ChipPAC, Inc.
- Rajendra Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale package with flip chip interconnect
- Publication number 20020151189
- Publication date Oct 17, 2002
- ChipPAC, Inc.
- Rajendra Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-coplanarity bumping shape for flip chip
- Publication number 20020151228
- Publication date Oct 17, 2002
- ChipPAC, Inc.
- Young-Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure and method
- Publication number 20020014702
- Publication date Feb 7, 2002
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS

Nazir Ahmad

Person

Patents Grantslast 30 patents

Electrical connectors of building integrable photovoltaic modules

Semiconductor device and method of forming a metallurgical intercon...

Electrical connectors of building integrable photovoltaic modules

Interconnecting a chip and a substrate by bonding pure metal bumps...

Self-coplanarity bumping shape for flip-chip

Self-coplanarity bumping shape for flip chip

Self-coplanarity bumping shape for flip chip

Chip scale package with flip chip interconnect

Method of making energy storage device having electrodes coated wit...

Energy storage device

Energy storage device and methods of manufacture

Patents Applicationslast 30 patents

ELECTRICAL CONNECTORS OF BUILDING INTEGRABLE PHOTOVOLTAIC MODULES

ELECTRICAL TERMINATIONS FOR FLEXIBLE PHOTOVOLTAIC MODULES

Semiconductor Device and Method of Forming a Metallurgical Intercon...

Packaging Structure and Method

Semiconductor Device and Method of Forming a Metallurgical Intercon...

Packaging Structure and Method

Packaging Structure and Method

Packaging structure and method

Self-coplanarity bumping shape for flip chip

Method for making self-coplanarity bumping shape for flip chip

Chip scale package with flip chip interconnect

Chip scale package with flip chip interconnect

Self-coplanarity bumping shape for flip chip

Packaging structure and method